HEATSINK FOR 45MM BGA
| Part | Attachment Method | Length | Length | Package Cooled | Material Finish | Shape | Material | Thermal Resistance @ Forced Air Flow | Type | Width [x] | Width [x] | Fin Height | Fin Height | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield-Vette  | Thermal Tape  Adhesive (Included)  | 44.45 mm  | 1.75 in  | ASIC  BGA  CPU  LGA  | Black Anodized  | Pin Fins  Square  | Aluminum  | 10 °C/W  150 LFM  | Top Mount  | 43.18 mm  | 1.7 in  | 8.89 mm  | 0.35 in  | 
Wakefield-Vette  | Thermal Tape  Adhesive (Included)  | 44.45 mm  | 1.75 in  | ASIC  BGA  CPU  LGA  | Black Anodized  | Pin Fins  Square  | Aluminum  | 10 °C/W  150 LFM  | Top Mount  | 43.18 mm  | 1.7 in  | 8.89 mm  | 0.35 in  | 
Wakefield-Vette  | Thermal Tape  Adhesive (Included)  | 44.45 mm  | 1.75 in  | ASIC  BGA  CPU  LGA  | Black Anodized  | Pin Fins  Square  | Aluminum  | 10 °C/W  150 LFM  | Top Mount  | 43.18 mm  | 1.7 in  | 8.89 mm  | 0.35 in  | 
Wakefield-Vette  | Thermal Tape  Adhesive (Included)  | 44.45 mm  | 1.75 in  | ASIC  BGA  CPU  LGA  | Black Anodized  | Pin Fins  Square  | Aluminum  | 10 °C/W  150 LFM  | Top Mount  | 43.18 mm  | 1.7 in  | 8.89 mm  | 0.35 in  |