240-1280-00-0602J
Active3M
IC & COMPONENT SOCKET, 40 CONTACTS, DIP SOCKET, 2.54 MM, 240 SERIES, 15.24 MM, BERYLLIUM COPPER
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240-1280-00-0602J
Active3M
IC & COMPONENT SOCKET, 40 CONTACTS, DIP SOCKET, 2.54 MM, 240 SERIES, 15.24 MM, BERYLLIUM COPPER
Deep-Dive with AI
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | 240-1280-00-0602J | 240 Series |
|---|---|---|
| Contact Finish - Mating | Gold | Gold |
| Contact Finish - Post | Gold | Gold |
| Contact Finish Thickness - Mating | 30 Áin | 30 Áin |
| Contact Finish Thickness - Mating | 0.76 Ám | 0.76 Ám |
| Contact Finish Thickness - Post | 30 µin | 30 µin |
| Contact Finish Thickness - Post | 0.76 µm | 0.76 - 30 µm |
| Contact Finish Thickness - Post | - | 0.76 Ám |
| Contact Material - Mating | Beryllium Copper | Beryllium Copper |
| Contact Material - Post | Beryllium Copper | Beryllium Copper |
| Contact Resistance | 15 mOhm | 15 - 25 mOhm |
| Convert From (Adapter End) | - | 15.24 mm |
| Convert From (Adapter End) | - | DIP |
| Convert From (Adapter End) | - | 0.6 - 25.4 in |
| Convert From (Adapter End) | - | 1 in |
| Convert To (Adapter End) | - | 0.6 in |
| Convert To (Adapter End) | - | DIP |
| Convert To (Adapter End) | - | 1 - 15.24 mm |
| Convert To (Adapter End) | - | 25.4 mm |
| Current Rating (Amps) | 1 A | 1 A |
| Features | Closed Frame | Closed Frame |
| Housing Material | Polysulfone (PSU), Glass Filled | Polyethersulfone (PES), Polysulfone (PSU), Glass Filled |
| Material Flammability Rating | UL94 V-0 | UL94 V-0 |
| Mounting Type | Connector | Through Hole, Connector |
| Number of Pins | - | 40 |
| Number of Positions or Pins (Grid) | 40 | 40 |
| Number of Positions or Pins (Grid) | - | 40 |
| Number of Positions or Pins (Grid) [custom] | 20 | 10 - 20 |
| Number of Positions or Pins (Grid) [custom] | 2 | 2 - 4 |
| Operating Temperature [Max] | 125 °C | 125 °C |
| Operating Temperature [Min] | -55 °C | -55 °C |
| Pitch - Mating | 0.1 in | 0.1 in |
| Pitch - Mating | 2.54 mm | 2.54 mm |
| Pitch - Post | 2.54 mm | 2.54 mm |
| Pitch - Post | 0.1 in | 0.1 in |
| Termination | Press-Fit | Solder, Press-Fit, Wire Wrap |
| Termination Post Length | 0.11 in | 0.11 - 0.13 in |
| Termination Post Length | 2.78 mm | 2.78 - 3.3 mm |
| Termination Post Length | - | 0.62 in |
| Termination Post Length | - | 15.75 mm |
| Type | 15.24 mm | 15.24 mm |
| Type | DIP, ZIF (ZIP) | QFN, DIP, ZIF (ZIP) |
| Type | 0.6 " | 0.6 " |
240 Series
IC & COMPONENT SOCKET, 40 CONTACTS, QFN TEST SOCKET, 0.5 MM, 240 SERIES, BERYLLIUM COPPER
| Part | Contact Material - Post | Housing Material | Contact Resistance | Contact Finish - Mating | Features | Mounting Type | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Type | Contact Finish - Post | Contact Material - Mating | Termination | Termination Post Length | Termination Post Length | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Post | Pitch - Post | Type | Type | Material Flammability Rating | Number of Positions or Pins (Grid) | Current Rating (Amps) | Operating Temperature [Min] | Operating Temperature [Max] | Convert From (Adapter End) | Convert From (Adapter End) | Convert From (Adapter End) | Number of Pins | Convert To (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Termination Post Length [x] | Termination Post Length [x] | Convert To (Adapter End) | Convert From (Adapter End) | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Beryllium Copper | Polyethersulfone (PES) | 25 mOhm | Gold | Closed Frame | Through Hole | 10 | 40 | 4 | QFN | Gold | Beryllium Copper | Solder | 0.118 in | 3 mm | ||||||||||||||||||||||||||||
Beryllium Copper | Polysulfone (PSU), Glass Filled | 15 mOhm | Gold | Closed Frame | Connector | 20 | 2 | DIP, ZIF (ZIP) | Gold | Beryllium Copper | Press-Fit | 0.11 in | 2.78 mm | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | 2.54 mm | 0.1 in | 15.24 mm | 0.6 " | UL94 V-0 | 40 | 1 A | -55 °C | 125 °C | ||||||||||||||
Beryllium Copper | Polysulfone (PSU), Glass Filled | Gold | Closed Frame | Through Hole | Gold | Beryllium Copper | Solder | 0.13 in | 3.3 mm | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | 2.54 mm | 0.1 in | UL94 V-0 | 1 A | -55 °C | 125 °C | 15.24 mm | DIP | 0.6 in | 40 | 0.6 in | DIP | 15.24 mm | ||||||||||||||
Beryllium Copper | Polysulfone (PSU), Glass Filled | Gold | Closed Frame | Through Hole | Gold | Beryllium Copper | Wire Wrap | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | 2.54 mm | 0.1 in | UL94 V-0 | 1 A | -55 °C | 125 °C | DIP | 25.4 mm | 40 | DIP | 1 " | 0.62 in | 15.75 mm | 25.4 mm | 1 in | ||||||||||||||
Beryllium Copper | Polyethersulfone (PES) | 25 mOhm | Gold | Closed Frame | Through Hole | 10 | 40 | 4 | QFN | Gold | Beryllium Copper | Solder | 0.118 in | 3 mm | ||||||||||||||||||||||||||||
Beryllium Copper | Polysulfone (PSU), Glass Filled | Gold | Through Hole | Gold | Beryllium Copper | Solder | 0.13 in | 3.3 mm | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | 2.54 mm | 0.1 in | UL94 V-0 | 1 A | -55 °C | 125 °C | 15.24 mm | DIP | 0.6 in | 40 | 0.6 in | DIP | 15.24 mm | |||||||||||||||
Beryllium Copper | Polysulfone (PSU), Glass Filled | Gold | Closed Frame | Through Hole | Gold | Beryllium Copper | Solder | 0.13 in | 3.3 mm | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 Áin | 2.54 mm | 0.1 in | UL94 V-0 | 1 A | -55 °C | 125 °C | DIP | 25.4 mm | 40 | DIP | 1 " | 25.4 mm | 1 in | 0.76 Ám | ||||||||||||||
Beryllium Copper | Polysulfone (PSU), Glass Filled | Gold | Closed Frame | Through Hole | Gold | Beryllium Copper | Wire Wrap | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | 2.54 mm | 0.1 in | UL94 V-0 | 1 A | -55 °C | 125 °C | 15.24 mm | DIP | 0.6 in | 40 | 0.6 in | DIP | 15.24 mm | 0.62 in | 15.75 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
240 Series
The 240-1280-00-0602J is a 40-way Textool™ DIP Socket with gold-plated beryllium copper contacts, 2.54mm lead spacing. This socket is glass filled polysulfone insulated, easily disassembles for repairability, lever actuated zero insertion force mechanism.
Documents
Technical documentation and resources