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40-3552-18

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Aries Electronics

CONN IC DIP SOCKET ZIF 40POS

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40-3552-18

Active
Aries Electronics

CONN IC DIP SOCKET ZIF 40POS

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification40-3552-18
Contact Finish - MatingNickel Boron
Contact Finish - PostNickel Boron
Contact Finish Thickness - Mating1.27 µm
Contact Finish Thickness - Mating50 µin
Contact Finish Thickness - Post1.27 µm
Contact Finish Thickness - Post50 µin
Contact Material - MatingBeryllium Nickel
Contact Material - PostBeryllium Nickel
Current Rating (Amps)1 A
FeaturesClosed Frame
Housing MaterialPolyetheretherketone (PEEK), Glass Filled
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)40
Number of Positions or Pins (Grid) [custom]20
Number of Positions or Pins (Grid) [custom]2
Operating Temperature [Max]250 °C
Operating Temperature [Min]-55 °C
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length0.11 in
Termination Post Length2.78 mm
Type7.62 mm
Type0.3 in
TypeDIP, ZIF (ZIP)

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 7$ 140.30

Description

General part information

40-3552 Series

40 (2 x 20) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Nickel Boron Through Hole

Documents

Technical documentation and resources

No documents available