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CONN IC DIP SOCKET ZIF 40POS
| Part | Mounting Type | Material Flammability Rating | Pitch - Post | Pitch - Post | Termination | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Housing Material | Contact Finish - Mating | Termination Post Length | Termination Post Length | Contact Finish - Post | Features | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Current Rating (Amps) | Type | Type | Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Through Hole | UL94 V-0 | 2.54 mm | 0.1 in | Solder | 0.1 in | 2.54 mm | Beryllium Nickel | -55 °C | 250 °C | Polyetheretherketone (PEEK) Glass Filled | Nickel Boron | 0.11 in | 2.78 mm | Nickel Boron | Closed Frame | 40 | 20 | 2 | 1 A | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 1.27 µm | 50 µin | Beryllium Nickel | 1.27 µm | 50 µin |