Specification	181-PRS18040-12

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	30 µin
Contact Finish Thickness - Post	200 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Features	Closed Frame
Housing Material	PPS, Polyphenylene Sulfide
Mounting Type	Through Hole
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-65 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Solder
Type	PGA, ZIF (ZIP)

PRS Series

Part	Housing Material	Type	Features	Termination	Contact Material - Mating	Pitch - Post	Pitch - Mating	Contact Material - Post	Contact Finish - Post	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish Thickness - Post	Contact Finish - Mating	Contact Finish Thickness - Mating	Mounting Type	Current Rating	Termination Post Length	Material Flammability Rating
Aries Electronics 181-PRS18040-12	Polyphenylene Sulfide PPS	PGA ZIF (ZIP)	Closed Frame	Solder	Beryllium Copper	0.1 in	0.1 in	Beryllium Copper	Tin	125 °C	-65 °C	200 µin	Gold	30 µin	Through Hole
Aries Electronics 65-PRS10008-12	Polyphenylene Sulfide PPS	PGA ZIF (ZIP)	Closed Frame	Solder	Beryllium Copper	0.1 in	0.1 in	Beryllium Copper	Tin	125 °C	-65 °C	200 µin	Gold	30 µin	Through Hole
Aries Electronics 209-PRS17030-12	Polyphenylene Sulfide PPS	PGA ZIF (ZIP)	Closed Frame	Solder	Beryllium Copper	0.1 in	0.1 in	Beryllium Copper	Tin	125 °C	-65 °C	200 µin	Gold	30 µin	Through Hole	1 A	0.125 in	UL94 V-0

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