PRS Series

Catalog

IC & COMPONENT SOCKETS 181 PIN PGA GOLD

Part	Housing Material	Type	Features	Termination	Contact Material - Mating	Pitch - Post	Pitch - Mating	Contact Material - Post	Contact Finish - Post	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish Thickness - Post	Contact Finish - Mating	Contact Finish Thickness - Mating	Mounting Type	Current Rating	Termination Post Length	Material Flammability Rating
Aries Electronics 181-PRS18040-12	Polyphenylene Sulfide PPS	PGA ZIF (ZIP)	Closed Frame	Solder	Beryllium Copper	0.1 in	0.1 in	Beryllium Copper	Tin	125 °C	-65 °C	200 µin	Gold	30 µin	Through Hole
Aries Electronics 65-PRS10008-12	Polyphenylene Sulfide PPS	PGA ZIF (ZIP)	Closed Frame	Solder	Beryllium Copper	0.1 in	0.1 in	Beryllium Copper	Tin	125 °C	-65 °C	200 µin	Gold	30 µin	Through Hole
Aries Electronics 209-PRS17030-12	Polyphenylene Sulfide PPS	PGA ZIF (ZIP)	Closed Frame	Solder	Beryllium Copper	0.1 in	0.1 in	Beryllium Copper	Tin	125 °C	-65 °C	200 µin	Gold	30 µin	Through Hole	1 A	0.125 in	UL94 V-0