Specification	264-5205-01

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Contact Resistance	25 mOhm
Features	Open Frame
Grid Columns	16
Grid Rows	4
Housing Material	PES, Polyethersulfone
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	64
Pitch - Mating	0.02 in
Pitch - Post	0.02 in
Termination	Solder
Termination Post Length	0.114 in
Type	QFN

264 Series

Part	Contact Material - Mating	Termination	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Contact Material - Post	Contact Finish - Post	Features	Pitch - Mating	Contact Finish - Mating	Mounting Type	Type	Pitch - Post	Housing Material	Termination Post Length	Contact Resistance	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Operating Temperature (Max)	Operating Temperature (Min)	Row Spacing	Current Rating	Material Flammability Rating
3M Electronic Specialty 264-5205-01	Beryllium Copper	Solder	4	64	16	Beryllium Copper	Gold	Open Frame	0.02 in	Gold	Through Hole	QFN	0.02 in	PES Polyethersulfone	0.114 in	25 mOhm
3M Electronic Specialty 264-4493-00-0602J	Beryllium Copper	Press-Fit	2	64	32	Beryllium Copper	Gold	Closed Frame	0.1 in	Gold	Connector	0.9" (22.86mm) Row Spacing DIP ZIF (ZIP)	0.1 in	Glass Filled Polysulfone PSU	0.11 in		30 µin	30 µin	125 °C	-55 °C	0.9 in	1 A	UL94 V-0
3M Electronic Specialty 264-4205-00
3M Electronic Specialty 264-1300-00-0602J	Beryllium Copper	Press-Fit	2	64	32	Beryllium Copper	Gold	Closed Frame	0.07 in	Gold	Connector	0.9" (22.86mm) Row Spacing DIP ZIF (ZIP)	0.07 in	Glass Filled Polysulfone PSU	0.11 in	15 mOhm	30 µin	30 µin	125 °C	-55 °C	0.9 in	1 A	UL94 V-0

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