264 Series
Manufacturer: 3M Electronic Specialty
Beta
⌘K
IC & COMPONENT SOCKET, 64 CONTACTS, QFN TEST SOCKET, 0.5 MM, 264 SERIES, BERYLLIUM COPPER
| Part | Contact Material - Mating | Termination | Grid Rows | Number of Positions or Pins (Grid) | Grid Columns | Contact Material - Post | Contact Finish - Post | Features | Pitch - Mating | Contact Finish - Mating | Mounting Type | Type | Pitch - Post | Housing Material | Termination Post Length | Contact Resistance | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Operating Temperature (Max) | Operating Temperature (Min) | Row Spacing | Current Rating | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 3M Electronic Specialty | Beryllium Copper | Solder | 4 | 64 | 16 | Beryllium Copper | Gold | Open Frame | 0.02 in | Gold | Through Hole | QFN | 0.02 in | PES Polyethersulfone | 0.114 in | 25 mOhm | |||||||
 3M Electronic Specialty | Beryllium Copper | Press-Fit | 2 | 64 | 32 | Beryllium Copper | Gold | Closed Frame | 0.1 in | Gold | Connector | 0.9" (22.86mm) Row Spacing DIP ZIF (ZIP) | 0.1 in | Glass Filled Polysulfone PSU | 0.11 in | 30 µin | 30 µin | 125 °C | -55 °C | 0.9 in | 1 A | UL94 V-0 | |
 3M Electronic Specialty | |||||||||||||||||||||||
 3M Electronic Specialty | Beryllium Copper | Press-Fit | 2 | 64 | 32 | Beryllium Copper | Gold | Closed Frame | 0.07 in | Gold | Connector | 0.9" (22.86mm) Row Spacing DIP ZIF (ZIP) | 0.07 in | Glass Filled Polysulfone PSU | 0.11 in | 15 mOhm | 30 µin | 30 µin | 125 °C | -55 °C | 0.9 in | 1 A | UL94 V-0 |