10-2513-10H

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Aries Electronics

CONN IC DIP SOCKET 10POS GOLD

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Aries Electronics

CONN IC DIP SOCKET 10POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	10-2513-10H

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Closed Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid) [custom]	2 x 5
Number of Positions or Pins (Grid) [custom]	10
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in
Type	DIP
Type	5.08 mm
Type	0.2 in

Part	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Features	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Termination	Operating Temperature [Max]	Operating Temperature [Min]	Housing Material	Pitch - Mating	Pitch - Mating	Mounting Type	Contact Material - Post [custom]	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Contact Finish - Post	Type	Type	Type	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Aries Electronics 10-2513-10T	3 A	10 çin	0.25 çm	Beryllium Copper	Closed Frame	3.18 mm	0.125 in	2.54 mm	0.1 in	Solder	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Through Hole	Brass	UL94 V-0	200 µin	5.08 µm	Gold	Tin	DIP	5.08 mm	0.2 in	2 x 5	10
Aries Electronics 10-2513-10H	3 A	10 çin	0.25 çm	Beryllium Copper	Closed Frame	3.18 mm	0.125 in	2.54 mm	0.1 in	Solder	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Through Hole	Brass	UL94 V-0	200 µin	5.08 µm	Gold	Tin	DIP	5.08 mm	0.2 in	2 x 5	10
Aries Electronics 10-2513-10	3 A	10 çin	0.25 çm	Beryllium Copper	Closed Frame	3.18 mm	0.125 in	2.54 mm	0.1 in	Solder	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Through Hole	Brass	UL94 V-0	200 µin	5.08 µm	Gold	Tin	DIP	5.08 mm	0.2 in	2 x 5	10

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	174	$ 2.91

General part information

10 (2 x 5) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources