10-2513 Series

Catalog

CONN IC DIP SOCKET 10POS GOLD

Part	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Features	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Termination	Operating Temperature [Max]	Operating Temperature [Min]	Housing Material	Pitch - Mating	Pitch - Mating	Mounting Type	Contact Material - Post [custom]	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Contact Finish - Post	Type	Type	Type	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Aries Electronics 10-2513-10T	3 A	10 çin	0.25 çm	Beryllium Copper	Closed Frame	3.18 mm	0.125 in	2.54 mm	0.1 in	Solder	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Through Hole	Brass	UL94 V-0	200 µin	5.08 µm	Gold	Tin	DIP	5.08 mm	0.2 in	2 x 5	10
Aries Electronics 10-2513-10H	3 A	10 çin	0.25 çm	Beryllium Copper	Closed Frame	3.18 mm	0.125 in	2.54 mm	0.1 in	Solder	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Through Hole	Brass	UL94 V-0	200 µin	5.08 µm	Gold	Tin	DIP	5.08 mm	0.2 in	2 x 5	10
Aries Electronics 10-2513-10	3 A	10 çin	0.25 çm	Beryllium Copper	Closed Frame	3.18 mm	0.125 in	2.54 mm	0.1 in	Solder	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Through Hole	Brass	UL94 V-0	200 µin	5.08 µm	Gold	Tin	DIP	5.08 mm	0.2 in	2 x 5	10