40-3554-10

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Aries Electronics

CONN IC DIP SOCKET ZIF 40POS TIN

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Aries Electronics

CONN IC DIP SOCKET ZIF 40POS TIN

Technical Specifications

Parameters and characteristics for this part

Specification	40-3554-10

Contact Finish - Post	Tin
Contact Finish Thickness - Mating	5.08 µm
Contact Finish Thickness - Mating	200 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	40
Number of Positions or Pins (Grid) [custom]	20
Number of Positions or Pins (Grid) [custom]	2
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.11 in
Termination Post Length	2.78 mm
Type	7.62 mm
Type	0.3 in
Type	DIP, ZIF (ZIP)

Part	Contact Finish - Post	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Current Rating (Amps)	Pitch - Post	Pitch - Post	Termination	Housing Material	Mounting Type	Termination Post Length	Termination Post Length	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Type	Type	Type	Contact Material - Mating	Contact Finish - Mating
Aries Electronics 40-3554-10	Tin	Beryllium Copper	200 µin	5.08 µm	Closed Frame	UL94 V-0	5.08 µm	200 µin	0.1 in	2.54 mm	1 A	2.54 mm	0.1 in	Solder	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	0.11 in	2.78 mm	40	20	2	7.62 mm	0.3 in	DIP ZIF (ZIP)	Beryllium Copper
Aries Electronics 40-3554-16	Nickel Boron	Beryllium Copper	50 µin	1.27 µm	Closed Frame	UL94 V-0	1.27 µm	50 µin	0.1 in	2.54 mm	1 A	2.54 mm	0.1 in	Solder	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	0.11 in	2.78 mm	40	20	2	7.62 mm	0.3 in	DIP ZIF (ZIP)	Beryllium Copper	Nickel Boron

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	28	$ 15.87

General part information

40 (2 x 20) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Tin Through Hole

Technical documentation and resources