40-3554 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS TIN

Part	Contact Finish - Post	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Current Rating (Amps)	Pitch - Post	Pitch - Post	Termination	Housing Material	Mounting Type	Termination Post Length	Termination Post Length	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Type	Type	Type	Contact Material - Mating	Contact Finish - Mating
Aries Electronics 40-3554-10	Tin	Beryllium Copper	200 µin	5.08 µm	Closed Frame	UL94 V-0	5.08 µm	200 µin	0.1 in	2.54 mm	1 A	2.54 mm	0.1 in	Solder	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	0.11 in	2.78 mm	40	20	2	7.62 mm	0.3 in	DIP ZIF (ZIP)	Beryllium Copper
Aries Electronics 40-3554-16	Nickel Boron	Beryllium Copper	50 µin	1.27 µm	Closed Frame	UL94 V-0	1.27 µm	50 µin	0.1 in	2.54 mm	1 A	2.54 mm	0.1 in	Solder	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	0.11 in	2.78 mm	40	20	2	7.62 mm	0.3 in	DIP ZIF (ZIP)	Beryllium Copper	Nickel Boron