Connectors, Interconnects

HTMS-114-02-G-D-SM

Active

Samtec Inc.

CONN HDR .050" 22POS

Connectors, Interconnects

HTMS-114-02-G-D-SM

Active

Samtec Inc.

CONN HDR .050" 22POS

Specifications Series Pricing CAD Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	HTMS-114-02-G-D-SM

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	3 µin
Contact Length - Mating	0.1 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Per Contact)	5 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.1 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions	28
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.05 in
Row Spacing - Mating	0.1 in
Shrouding	Unshrouded
Style	Board
Termination	Solder

HTMS-114 Series

Part	Contact Finish - Post	Termination	Shrouding	Fastening Type	Insulation Material	Pitch - Mating	Mounting Type	Style	Contact Material	Contact Length - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Current Rating (Per Contact)	Row Spacing - Mating	Number of Positions Loaded	Connector Type	Material Flammability Rating	Insulation Height	Contact Type	Contact Shape	Contact Finish Thickness - Mating	Number of Rows	Number of Positions	Insulation Color	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Length - Post	Overall Contact Length
Samtec Inc. HTMS-114-01-F-D-SM	Tin	Solder	Unshrouded	Push-Pull	Liquid Crystal Polymer (LCP)	0.05 in	Surface Mount	Board	Phosphor Bronze	0.23 in	125 °C	-55 °C	5 A	0.1 in	All	Header	UL94 V-0	0.1 in	Male Pin	Square	3 µin	2	28	Black	Gold
Samtec Inc. HTMS-114-02-G-D-SM	Gold	Solder	Unshrouded	Push-Pull	Liquid Crystal Polymer (LCP)	0.05 in	Surface Mount	Board	Phosphor Bronze	0.1 in	125 °C	-55 °C	5 A	0.1 in	All	Header	UL94 V-0	0.1 in	Male Pin	Square	10 µin	2	28	Black	Gold	3 µin
Samtec Inc. HTMS-114-02-G-D	Gold	Solder	Unshrouded	Push-Pull	Liquid Crystal Polymer (LCP)	0.05 in	Through Hole	Board	Phosphor Bronze	0.1 in	125 °C	-55 °C	5 A	0.1 in	All	Header	UL94 V-0	0.1 in	Male Pin	Square	10 µin	2	28	Black	Gold	3 µin	0.12 in	0.32 in
Samtec Inc. HTMS-114-54-T-D-SM	Tin	Solder	Unshrouded	Push-Pull	Liquid Crystal Polymer (LCP)	0.05 in	Surface Mount	Board	Phosphor Bronze	0.335 in	105 °C	-55 °C	5 A	0.1 in	All	Header	UL94 V-0	0.1 in	Male Pin	Square		2	28	Black	Tin
Samtec Inc. HTMS-114-02-T-S-RA	Tin	Solder	Unshrouded	Push-Pull	Liquid Crystal Polymer (LCP)	0.05 in	Right Angle Through Hole	Board	Phosphor Bronze	0.1 in	105 °C	-55 °C	5 A		All	Header	UL94 V-0	0.096 in	Male Pin	Square		1	14	Black	Tin		0.14 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$	Updated

Digikey	Tube	6	$ 26.87	<6d
		12	$ 26.34
		24	$ 25.81
		32	$ 4.45
		96	$ 25.29
		120	$ 24.79
Samtec Inc.	N/A	1	$ 4.25	<1d
		25	$ 3.83
		50	$ 3.56
		100	$ 3.39
		500	$ 2.80
		1000	$ 2.60
		2500	$ 2.14
		5000	$ 1.65

CAD

3D models and CAD resources for this part

Description

General part information

HTMS-114 Series

Connector Header Surface Mount 28 position 0.050" (1.27mm)

Documents

Technical documentation and resources

No documents available