HTMS-114 Series

Catalog

THROUGH-HOLE MICRO HEADER, 0.050

Part	Contact Finish - Post	Termination	Shrouding	Fastening Type	Insulation Material	Pitch - Mating	Mounting Type	Style	Contact Material	Contact Length - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Current Rating (Per Contact)	Row Spacing - Mating	Number of Positions Loaded	Connector Type	Material Flammability Rating	Insulation Height	Contact Type	Contact Shape	Contact Finish Thickness - Mating	Number of Rows	Number of Positions	Insulation Color	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Length - Post	Overall Contact Length
Samtec Inc. HTMS-114-01-F-D-SM	Tin	Solder	Unshrouded	Push-Pull	Liquid Crystal Polymer (LCP)	0.05 in	Surface Mount	Board	Phosphor Bronze	0.23 in	125 °C	-55 °C	5 A	0.1 in	All	Header	UL94 V-0	0.1 in	Male Pin	Square	3 µin	2	28	Black	Gold
Samtec Inc. HTMS-114-02-G-D-SM	Gold	Solder	Unshrouded	Push-Pull	Liquid Crystal Polymer (LCP)	0.05 in	Surface Mount	Board	Phosphor Bronze	0.1 in	125 °C	-55 °C	5 A	0.1 in	All	Header	UL94 V-0	0.1 in	Male Pin	Square	10 µin	2	28	Black	Gold	3 µin
Samtec Inc. HTMS-114-02-G-D	Gold	Solder	Unshrouded	Push-Pull	Liquid Crystal Polymer (LCP)	0.05 in	Through Hole	Board	Phosphor Bronze	0.1 in	125 °C	-55 °C	5 A	0.1 in	All	Header	UL94 V-0	0.1 in	Male Pin	Square	10 µin	2	28	Black	Gold	3 µin	0.12 in	0.32 in
Samtec Inc. HTMS-114-54-T-D-SM	Tin	Solder	Unshrouded	Push-Pull	Liquid Crystal Polymer (LCP)	0.05 in	Surface Mount	Board	Phosphor Bronze	0.335 in	105 °C	-55 °C	5 A	0.1 in	All	Header	UL94 V-0	0.1 in	Male Pin	Square		2	28	Black	Tin
Samtec Inc. HTMS-114-02-T-S-RA	Tin	Solder	Unshrouded	Push-Pull	Liquid Crystal Polymer (LCP)	0.05 in	Right Angle Through Hole	Board	Phosphor Bronze	0.1 in	105 °C	-55 °C	5 A		All	Header	UL94 V-0	0.096 in	Male Pin	Square		1	14	Black	Tin		0.14 in