Specification	ICO-314-NGG

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 µin
Contact Finish Thickness - Post	30 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Features	Open Frame
Grid Columns	7
Grid Rows	2
Housing Material	Polyester, Glass Filled
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	14
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Row Spacing	0.3 in
Termination	Solder
Type	DIP, 0.3" (7.62mm) Row Spacing

ICO Series

IC & Component Sockets ".100"" Low Profile Screw Machine DIP Socket\/

Part	Features	Mounting Type	Contact Finish - Mating	Contact Material - Mating	Grid Rows	Grid Columns	Number of Positions or Pins (Grid)	Termination	Pitch - Post	Contact Finish Thickness - Post	Housing Material	Contact Material - Post	Pitch - Mating	Row Spacing	Type	Contact Finish - Post	Contact Finish Thickness - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Contact Resistance	Material Flammability Rating	Current Rating
Samtec Inc. ICO-320-SGT	Open Frame	Through Hole	Gold	Beryllium Copper	2	10	20	Solder	0.1 in	10 µin	Glass Filled Polyester	Brass	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	Tin	30 µin	125 °C	-55 °C
Samtec Inc. ICO-324-ZNGG	Open Frame	Through Hole	Gold	Beryllium Copper	2	12	24	Solder	0.1 in	30 µin	Glass Filled Polyester	Brass	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	Gold	30 µin	125 °C	-55 °C	10 mOhm	UL94 V-0	1 A
Samtec Inc. ICO-318-ZNGT	Open Frame	Through Hole	Gold	Beryllium Copper	2	9	18	Solder	0.1 in	10 µin	Glass Filled Polyester	Brass	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	Tin	30 µin	125 °C	-55 °C	10 mOhm	UL94 V-0	1 A
Samtec Inc. ICO-314-ZSGG-L	Open Frame	Through Hole	Gold	Beryllium Copper	2	7	14	Solder	0.1 in	30 µin	Glass Filled Polyester	Brass	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	Gold	30 µin	125 °C	-55 °C	10 mOhm	UL94 V-0	1 A
Samtec Inc. ICO-316-SGT-L	Open Frame	Through Hole	Gold	Beryllium Copper	2	8	16	Solder	0.1 in	10 µin	Glass Filled Polyester	Brass	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	Tin	30 µin	125 °C	-55 °C	10 mOhm	UL94 V-0	1 A
Samtec Inc. ICO-318-NTT	Open Frame	Through Hole	Tin	Beryllium Copper	2	9	18	Solder	0.1 in		Glass Filled Polyester	Brass	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	Tin		105 °C	-55 °C	10 mOhm	UL94 V-0	1 A
Samtec Inc. ICO-314-NGG	Open Frame	Through Hole	Gold	Beryllium Copper	2	7	14	Solder	0.1 in	30 µin	Glass Filled Polyester	Brass	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	Gold	30 µin	125 °C	-55 °C
Samtec Inc. ICO-314-ZLGT	Open Frame	Through Hole	Gold	Beryllium Copper	2	7	14	Solder	0.1 in	10 µin	Glass Filled Polyester	Brass	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP	Tin	30 µin	125 °C	-55 °C
Samtec Inc. ICO-628-ZLGT	Open Frame	Through Hole	Gold	Beryllium Copper	2	14	28	Solder	0.1 in	10 µin	Glass Filled Polyester	Brass	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP	Tin	30 µin	125 °C	-55 °C
Samtec Inc. ICO-422-SGG	Open Frame	Through Hole	Gold	Beryllium Copper	2	11	22	Solder	0.1 in	30 µin	Glass Filled Polyester	Brass	0.1 in	0.4 in	0.4" (10.16mm) Row Spacing DIP	Gold	30 µin	125 °C	-55 °C	10 mOhm	UL94 V-0	1 A

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