ICO Series
IC & Component Sockets ".100"" Low Profile Screw Machine DIP Socket\/
Manufacturer: Samtec Inc.
Catalog
IC & Component Sockets ".100"" Low Profile Screw Machine DIP Socket\/
IC & Component Sockets ".100"" Low Profile Screw Machine DIP Socket\/
IC & Component Sockets ".100"" Low Profile Screw Machine DIP Socket\/
IC & Component Sockets ".100"" Low Profile Screw Machine DIP Socket\/
| Part | Features | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Contact Resistance | Contact Finish - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Type | Type | Type | Mounting Type | Contact Material - Mating | Contact Material - Post [custom] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Material Flammability Rating | Pitch - Post | Pitch - Post | Current Rating (Amps) | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Open Frame | Tin | 30 Áin | 0.76 Ám | Solder | 10 mOhm | Gold | -55 °C | 125 °C | 0.3 " | 7.62 mm | DIP | Through Hole | Beryllium Copper | Brass | 10 çin | 0.25 çm | UL94 V-0 | 2.54 mm | 0.1 in | 1 A | 16 | 0.1 in | 2.54 mm | ||
Samtec Inc. | Open Frame | Gold | 30 Áin | 0.76 Ám | Solder | 10 mOhm | Gold | -55 °C | 125 °C | 0.4 in | 10.16 mm | DIP | Through Hole | Beryllium Copper | Brass | 30 µin | 0.76 µm | UL94 V-0 | 2.54 mm | 0.1 in | 1 A | 22 | 0.1 in | 2.54 mm | ||
Samtec Inc. | Open Frame | Tin | 30 Áin | 0.76 Ám | Solder | 10 mOhm | Gold | -55 °C | 125 °C | 0.6 in | 15.24 mm | DIP | Through Hole | Beryllium Copper | Brass | 10 çin | 0.25 çm | UL94 V-0 | 2.54 mm | 0.1 in | 1 A | 0.1 in | 2.54 mm | 2 x 16 | 32 | |
Samtec Inc. | Open Frame | Tin | 30 Áin | 0.76 Ám | Solder | 10 mOhm | Gold | -55 °C | 125 °C | 0.6 in | 15.24 mm | DIP | Through Hole | Beryllium Copper | Brass | 10 çin | 0.25 çm | UL94 V-0 | 2.54 mm | 0.1 in | 1 A | 0.1 in | 2.54 mm | 2 x 16 | 32 | |
Samtec Inc. | Open Frame | Tin | 30 Áin | 0.76 Ám | Solder | 10 mOhm | Gold | -55 °C | 125 °C | 0.3 " | 7.62 mm | DIP | Through Hole | Beryllium Copper | Brass | 10 çin | 0.25 çm | UL94 V-0 | 2.54 mm | 0.1 in | 1 A | 16 | 0.1 in | 2.54 mm | ||
Samtec Inc. | Open Frame | Tin | 30 Áin | 0.76 Ám | Solder | 10 mOhm | Gold | -55 °C | 125 °C | 0.6 in | 15.24 mm | DIP | Through Hole | Beryllium Copper | Brass | 10 çin | 0.25 çm | UL94 V-0 | 2.54 mm | 0.1 in | 1 A | 24 | 0.1 in | 2.54 mm | ||
Samtec Inc. | Open Frame | Gold | 30 Áin | 0.76 Ám | Solder | 10 mOhm | Gold | -55 °C | 125 °C | 0.3 " | 7.62 mm | DIP | Through Hole | Beryllium Copper | Brass | 30 µin | 0.76 µm | UL94 V-0 | 2.54 mm | 0.1 in | 1 A | 14 | 0.1 in | 2.54 mm | ||
Samtec Inc. | Open Frame | Gold | 30 Áin | 0.76 Ám | Solder | 10 mOhm | Gold | -55 °C | 125 °C | 0.3 " | 7.62 mm | DIP | Through Hole | Beryllium Copper | Brass | 30 µin | 0.76 µm | UL94 V-0 | 2.54 mm | 0.1 in | 1 A | 8 | 0.1 in | 2.54 mm |