Part	Contact Shape	Number of Rows	Number of Positions	Style	Contact Finish - Post	Fastening Type	Insulation Material	Current Rating	Voltage Rating	Pitch - Mating	Overall Contact Length	Contact Length - Post	Contact Length - Mating	Row Spacing - Mating	Material Flammability Rating	Number of Positions Loaded	Termination	Contact Type	Contact Finish - Mating	Insulation Height	Operating Temperature (Min)	Operating Temperature (Max)	Insulation Color	Contact Material	Mounting Type	Shrouding	Connector Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Post
Omron Electronics Inc-EMC Div XG8T-1441	Square	2	14	Board Board or Cable	Tin	Push-Pull	Glass Filled Polybutylene Terephthalate (PBT)	2 A	300 VAC/DC	0.1 in	0.386 in	0.118 in	0.169 in	0.1 in	UL94 V-0	All	Solder	Male Pin	Tin	0.098 in	-55 °C	105 °C	Black	Brass Nickel	Through Hole	Unshrouded	Header
Omron Electronics Inc-EMC Div XG8T-0841	Square	2	8	Board Board or Cable	Tin	Push-Pull	Glass Filled Polybutylene Terephthalate (PBT)	2 A	300 VAC/DC	0.1 in	0.386 in	0.118 in	0.169 in	0.1 in	UL94 V-0	All	Solder	Male Pin	Tin	0.098 in	-55 °C	105 °C	Black	Brass Nickel	Through Hole	Unshrouded	Header
Omron Electronics Inc-EMC Div XG8T-0641	Square	2	6	Board Board or Cable	Tin	Push-Pull	Glass Filled Polybutylene Terephthalate (PBT)	2 A	300 VAC/DC	0.1 in	0.386 in	0.118 in	0.169 in	0.1 in	UL94 V-0	All	Solder	Male Pin	Tin	0.098 in	-55 °C	105 °C	Black	Brass Nickel	Through Hole	Unshrouded	Header
Omron Electronics Inc-EMC Div XG8T-1841	Square	2	18	Board Board or Cable	Tin	Push-Pull	Glass Filled Polybutylene Terephthalate (PBT)	2 A	300 VAC/DC	0.1 in	0.386 in	0.118 in	0.169 in	0.1 in	UL94 V-0	All	Solder	Male Pin	Tin	0.098 in	-55 °C	105 °C	Black	Brass Nickel	Through Hole	Unshrouded	Header
Omron Electronics Inc-EMC Div XG8T-0831	Square	2	8	Board Board or Cable	Gold	Push-Pull	Glass Filled Polybutylene Terephthalate (PBT)	2 A	300 VAC/DC	0.1 in	0.386 in	0.118 in	0.169 in	0.1 in	UL94 V-0	All	Solder	Male Pin	Gold	0.098 in	-55 °C	105 °C	Black	Brass Nickel	Through Hole	Unshrouded	Header	5.9 µin	5.9 µin
Omron Electronics Inc-EMC Div XG8T-1831	Square	2	18	Board Board or Cable	Gold	Push-Pull	Glass Filled Polybutylene Terephthalate (PBT)	2 A	300 VAC/DC	0.1 in	0.386 in	0.118 in	0.169 in	0.1 in	UL94 V-0	All	Solder	Male Pin	Gold	0.098 in	-55 °C	105 °C	Black	Brass Nickel	Through Hole	Unshrouded	Header	5.9 µin	5.9 µin
Omron Electronics Inc-EMC Div XG8T-0631	Square	2	6	Board Board or Cable	Gold	Push-Pull	Glass Filled Polybutylene Terephthalate (PBT)	2 A	300 VAC/DC	0.1 in	0.386 in	0.118 in	0.169 in	0.1 in	UL94 V-0	All	Solder	Male Pin	Gold	0.098 in	-55 °C	105 °C	Black	Brass Nickel	Through Hole	Unshrouded	Header	5.9 µin	5.9 µin
Omron Electronics Inc-EMC Div XG8T-0441	Square	2	4	Board Board or Cable	Tin	Push-Pull	Glass Filled Polybutylene Terephthalate (PBT)	2 A	300 VAC/DC	0.1 in	0.386 in	0.118 in	0.169 in	0.1 in	UL94 V-0	All	Solder	Male Pin	Tin	0.098 in	-55 °C	105 °C	Black	Brass Nickel	Through Hole	Unshrouded	Header
Omron Electronics Inc-EMC Div XG8T-1041	Square	2	10	Board Board or Cable	Tin	Push-Pull	Glass Filled Polybutylene Terephthalate (PBT)	2 A	300 VAC/DC	0.1 in	0.386 in	0.118 in	0.169 in	0.1 in	UL94 V-0	All	Solder	Male Pin	Tin	0.098 in	-55 °C	105 °C	Black	Brass Nickel	Through Hole	Unshrouded	Header
Omron Electronics Inc-EMC Div XG8T-1241	Square	2	12	Board Board or Cable	Tin	Push-Pull	Glass Filled Polybutylene Terephthalate (PBT)	2 A	300 VAC/DC	0.1 in	0.386 in	0.118 in	0.169 in	0.1 in	UL94 V-0	All	Solder	Male Pin	Tin	0.098 in	-55 °C	105 °C	Black	Brass Nickel	Through Hole	Unshrouded	Header