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TPCC8105,L1Q

TPCC8105,L1Q

Active
Toshiba Semiconductor and Storage

HIGH-SPEED, LOW-LOSS SOLUTIONS | TOSHIBA MOSFETS, P-CH MOSFET, -30 V, 0.0078 Ω@10V, TSON ADVANCE, U-MOSⅥ

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TPCC8105,L1Q

TPCC8105,L1Q

Active
Toshiba Semiconductor and Storage

HIGH-SPEED, LOW-LOSS SOLUTIONS | TOSHIBA MOSFETS, P-CH MOSFET, -30 V, 0.0078 Ω@10V, TSON ADVANCE, U-MOSⅥ

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Description

General part information

TPCC8105 Series

P-Channel 30 V 23A (Ta) 700mW (Ta), 30W (Tc) Surface Mount 8-TSON Advance (3.3x3.3)

Technical Specifications

Parameters and characteristics for this part

SpecificationTPCC8105,L1Q
Current - Continuous Drain (Id) (Ta)23 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On)4.5 V
Drive Voltage (Min Rds On)10 V
FET TypeP-Channel
Gate Charge (Max)76 nC, 76 nC
Input Capacitance (Ciss) (Max)3240 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-VDFN Exposed Pad
Package Length3.3 mm
Package Name8-TSON Advance
Package Width3.3 mm
Power Dissipation (Max)700 mW, 30 W
Rds On (Max)7.8 mOhm
TechnologyMOSFET (Metal Oxide)
Vgs (Max) Negative-25 V
Vgs (Max) Positive20 V
Vgs(th) (Max)2 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

TPCC8105,L1Q | Datasheet
Datasheet
Quick Reference Guide for Thermal Design for Power Semiconductor SMD type: Part 2
MOSFET SPICE model grade
Hints and Tips for Thermal Design for Discrete Semiconductor Devices
MOSFET Avalanche Ruggedness: Power MOSFET Application Notes
Derating of the MOSFET Safe Operating Area
Hints and Tips for Thermal Design part3
Electrical Characteristics: Power MOSFET Application Notes
Parasitic Oscillation between Parallel Power MOSFETs: Power MOSFET Application Notes
Resonant Circuits and Soft Switching
Parasitic Oscillation and Ringing: Power MOSFET Application Notes
U-MOSⅨ-H 60V Low VDS spike TPH1R306P1
Maximum Ratings: Power MOSFET Application Notes
Reverse Recovery Operation and Destruction of MOSFET Body Diode
Impacts of the dv/dt Rate on MOSFETs: Power MOSFET Application Notes
Efficiency evaluation of Half-bridge DC-DC converter supporting 48V Bus system
Selecting MOSFETs and Consideration for Circuit Design: Power MOSFET Application Notes
RC Snubbers for Step-Down Converters
Avalanche energy calculation
MOSFET Self-Turn-On Phenomenon
The thermal stability and thermal design:Bipolar Transistor Application Notes
The maximum ratings:Bipolar Transistor Application Notes
Motor Control (Vacuum Cleaners)
TPCC8105 Data sheet/Japanese
Simplified CFD Model Application Note
Calculating the Temperature of Discrete Semiconductor Devices
Quick Reference Guide for Thermal Design for Discrete Semiconductor Devices
The electrical characteristics and equivalent circuit:Bipolar Transistor Application Notes
Selection Guide MOSFETs 2025 Rev1.0
Thermal Design and Attachment of a Thermal Fin: Power MOSFET Application Notes
Structures and Characteristics: Power MOSFET Application Notes
MOSFET Secondary Breakdown
MOSFET Gate Drive Circuit: Power MOSFET Application Notes
Discrete Semiconductor Devices Hints and Tips for Thermal Design Part 2
The terms used in data sheets:Bipolar Transistor Application Notes