TSM-110-04-G-DV-A
ActiveSamtec Inc.
CONN HEADER SMD 20POS 2.54MM
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TSM-110-04-G-DV-A
ActiveSamtec Inc.
CONN HEADER SMD 20POS 2.54MM
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | TSM-110-04-G-DV-A |
|---|---|
| Connector Type | Cuttable, Header |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 10 çin |
| Contact Finish Thickness - Mating | 0.25 çm |
| Contact Finish Thickness - Post | 3 µin |
| Contact Finish Thickness - Post | 0.076 µm |
| Contact Length - Mating | 3.05 mm |
| Contact Length - Mating | 0.12 in |
| Contact Material | Phosphor Bronze |
| Contact Shape | Square |
| Contact Type | Male Pin |
| Fastening Type | Push-Pull |
| Features | Board Guide |
| Insulation Color | Black |
| Insulation Height | 0.1 in |
| Insulation Height | 2.54 mm |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Surface Mount |
| Number of Positions | 20 |
| Number of Positions Loaded | All |
| Number of Rows | 2 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Row Spacing - Mating [x] | 2.54 mm |
| Row Spacing - Mating [x] | 0.1 in |
| Shrouding | Unshrouded |
| Style | Board to Board, Cable |
| Termination | Solder |
TSM-110 Series
...
| Part | Contact Shape | Contact Material | Termination | Number of Rows | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Type | Contact Length - Mating | Contact Length - Mating | Number of Positions Loaded | Style | Shrouding | Insulation Color | Operating Temperature [Min] | Operating Temperature [Max] | Pitch - Mating | Pitch - Mating | Fastening Type | Insulation Height | Insulation Height | Number of Positions | Contact Finish - Mating | Insulation Material | Connector Type | Material Flammability Rating | Mounting Type | Features | Contact Length - Mating [x] | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Contact Length - Mating [x] | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Square | Phosphor Bronze | Solder | 1 | Tin | 30 Áin | 0.76 Ám | Male Pin | 0.42 in | 10.67 mm | All | Board to Board Cable | Unshrouded | Black | -55 °C | 125 °C | 0.1 in | 2.54 mm | Push-Pull | 0.1 in | 2.54 mm | 10 | Gold | Liquid Crystal Polymer (LCP) | Cuttable Header | UL94 V-0 | Surface Mount | |||||||
Samtec Inc. | Square | Phosphor Bronze | Solder | 1 | Tin | 30 Áin | 0.76 Ám | Male Pin | 0.32 in | 8.13 mm | All | Board to Board Cable | Unshrouded | Black | -55 °C | 125 °C | 0.1 in | 2.54 mm | Push-Pull | 0.1 in | 2.54 mm | 10 | Gold | Liquid Crystal Polymer (LCP) | Cuttable Header | UL94 V-0 | Surface Mount | Board Guide | ||||||
Samtec Inc. | Square | Phosphor Bronze | Solder | 1 | Tin | 10 çin | 0.25 çm | Male Pin | 0.12 in | 3.05 mm | All | Board to Board Cable | Unshrouded | Black | -55 °C | 125 °C | 0.1 in | 2.54 mm | Push-Pull | 0.1 in | 2.54 mm | 10 | Gold | Liquid Crystal Polymer (LCP) | Cuttable Header | UL94 V-0 | Surface Mount | Board Guide | ||||||
Samtec Inc. | Square | Phosphor Bronze | Solder | 1 | Tin | 10 çin | 0.25 çm | Male Pin | 5.84 mm | All | Board to Board Cable | Unshrouded | Black | -55 °C | 125 °C | 0.1 in | 2.54 mm | Push-Pull | 0.12 in | 3.05 mm | 10 | Gold | Liquid Crystal Polymer (LCP) | Header | UL94 V-0 | Surface Mount Right Angle | Board Guide Pick and Place | 0.23 in | ||||||
Samtec Inc. | Square | Phosphor Bronze | Solder | 2 | Tin | 10 çin | 0.25 çm | Male Pin | 0.12 in | 3.05 mm | All | Board to Board Cable | Unshrouded | Black | -55 °C | 125 °C | 0.1 in | 2.54 mm | Push-Pull | 0.24 in | 6.1 mm | 20 | Gold | Liquid Crystal Polymer (LCP) | Header | UL94 V-0 | Surface Mount Right Angle | Board Guide | 2.54 mm | 0.1 in | ||||
Samtec Inc. | Square | Phosphor Bronze | Solder | 2 | Tin | 3 µin | 0.076 µm | Male Pin | 5.84 mm | All | Board to Board Cable | Unshrouded | Black | -55 °C | 125 °C | 0.1 in | 2.54 mm | Push-Pull | 0.24 in | 6.1 mm | 20 | Gold | Liquid Crystal Polymer (LCP) | Header | UL94 V-0 | Surface Mount Right Angle | 0.23 in | 2.54 mm | 0.1 in | |||||
Samtec Inc. | Square | Phosphor Bronze | Solder | 2 | Tin | Male Pin | 5.84 mm | All | Board to Board Cable | Unshrouded | Black | -55 °C | 105 ░C | 0.1 in | 2.54 mm | Push-Pull | 0.1 in | 2.54 mm | 20 | Liquid Crystal Polymer (LCP) | Cuttable Header | UL94 V-0 | Surface Mount | 0.23 in | 2.54 mm | 0.1 in | ||||||||
Samtec Inc. | Square | Phosphor Bronze | Solder | 2 | Tin | Male Pin | All | Board to Board Cable | Unshrouded | Black | -55 °C | 105 ░C | 0.1 in | 2.54 mm | Push-Pull | 0.1 in | 2.54 mm | 20 | Liquid Crystal Polymer (LCP) | Cuttable Header | UL94 V-0 | Surface Mount | 0.075 in | 2.54 mm | 0.1 in | 1.9 mm | ||||||||
Samtec Inc. | Square | Phosphor Bronze | Solder | 2 | Gold | 10 çin | 0.25 çm | Male Pin | 0.12 in | 3.05 mm | All | Board to Board Cable | Unshrouded | Black | -55 °C | 125 °C | 0.1 in | 2.54 mm | Push-Pull | 0.1 in | 2.54 mm | 20 | Gold | Liquid Crystal Polymer (LCP) | Cuttable Header | UL94 V-0 | Surface Mount | Board Guide | 2.54 mm | 0.1 in | 3 µin | 0.076 µm | ||
Samtec Inc. | Square | Phosphor Bronze | Solder | 1 | Tin | Male Pin | 0.32 in | 8.13 mm | All | Board to Board Cable | Unshrouded | Black | -55 °C | 105 ░C | 0.1 in | 2.54 mm | Push-Pull | 0.12 in | 3.05 mm | 10 | Liquid Crystal Polymer (LCP) | Header | UL94 V-0 | Surface Mount Right Angle | Pick and Place |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tube | 1 | $ 3.33 | |
Description
General part information
TSM-110 Series
Connector Header Surface Mount 20 position 0.100" (2.54mm)
Documents
Technical documentation and resources