WS991AX500T4

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Chip Quik Inc.

SOLDER PASTE THERMALLY STABLE WS

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Chip Quik Inc.

SOLDER PASTE THERMALLY STABLE WS

Technical Specifications

Parameters and characteristics commom to parts in this series

SOLDER PASTE THERMALLY STABLE WS

Part	Shelf Life Start	Melting Point [custom]	Melting Point [custom]	Shelf Life	Type	Flux Type	Form	Form	Mesh Type [custom]	Process	Composition
Chip Quik Inc. WS991AX500T4	Date of Manufacture	361 °F	183 °C	6 Months	Solder Paste	Water Soluble	Jar	17.64 oz, 500 g	4	Leaded
Chip Quik Inc. WS991LT500T4	Date of Manufacture	281 °F	138 °C	6 Months	Solder Paste	Water Soluble	Jar	17.64 oz, 500 g	4		Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Chip Quik Inc. WS991SNL500T4	Date of Manufacture	423 °F	217 °C	6 Months	Solder Paste	Water Soluble	Jar	17.64 oz, 500 g	4		Sn96.5Ag3Cu0.5 (96.5/3/0.5)

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General part information

Leaded Water Soluble Solder Paste Sn63Pb37 (63/37) Jar, 17.64 oz (500g)

Technical documentation and resources