SOLDER PASTE THERMALLY STABLE WS
| Part | Shelf Life Start | Melting Point [custom] | Melting Point [custom] | Shelf Life | Type | Flux Type | Form | Form | Mesh Type [custom] | Process | Composition |
|---|---|---|---|---|---|---|---|---|---|---|---|
Chip Quik Inc. WS991AX500T4 | Date of Manufacture | 361 °F | 183 °C | 6 Months | Solder Paste | Water Soluble | Jar | 17.64 oz, 500 g | 4 | Leaded | |
Chip Quik Inc. WS991LT500T4 | Date of Manufacture | 281 °F | 138 °C | 6 Months | Solder Paste | Water Soluble | Jar | 17.64 oz, 500 g | 4 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | |
Chip Quik Inc. WS991SNL500T4 | Date of Manufacture | 423 °F | 217 °C | 6 Months | Solder Paste | Water Soluble | Jar | 17.64 oz, 500 g | 4 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |