2N6301
ActiveMicrochip Technology
POWER BJT TO-66 ROHS COMPLIANT: YES
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Search across all available documentation for this part.
2N6301
ActiveMicrochip Technology
POWER BJT TO-66 ROHS COMPLIANT: YES
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | 2N6301 |
|---|---|
| Current - Collector (Ic) (Max) [Max] | 8 A |
| Current - Collector Cutoff (Max) [Max] | 500 çA |
| DC Current Gain (hFE) (Min) @ Ic, Vce [Min] | 750 |
| Mounting Type | Through Hole |
| Operating Temperature [Max] | 200 C |
| Operating Temperature [Min] | -55 °C |
| Package / Case | TO-66-2, TO-213AA |
| Power - Max [Max] | 75 W |
| Supplier Device Package | TO-66 (TO-213AA) |
| Vce Saturation (Max) @ Ib, Ic | 3 V |
| Voltage - Collector Emitter Breakdown (Max) [Max] | 80 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 28.68 | |
| 100 | $ 26.64 | |||
| Microchip Direct | N/A | 1 | $ 28.67 | |
| Newark | Each | 100 | $ 26.62 | |
| 500 | $ 25.60 | |||
2N6301-Darlington Series
MIL-PRF-19500/539
| Part | DC Current Gain (hFE) (Min) @ Ic, Vce [Min] | Package / Case | Current - Collector (Ic) (Max) [Max] | Power - Max [Max] | Voltage - Collector Emitter Breakdown (Max) [Max] | Vce Saturation (Max) @ Ib, Ic | Supplier Device Package | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Current - Collector Cutoff (Max) [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology 2N6301 | 750 | TO-213AA, TO-66-2 | 8 A | 75 W | 80 V | 3 V | TO-66 (TO-213AA) | -55 °C | 200 C | Through Hole | 500 çA |
Description
General part information
2N6301-Darlington Series
This specification covers the performance requirements for NPN silicon power Darlington, 2N6300 and 2N6301 transistors. Three levels of product assurance (JAN, JANTX and JANTXV) are provided for each encapsulated device type as specified in MIL-PRF-19500/539. The device package outlines are as follows: TO-213AA (formerly TO-66) for all encapsulated device types.
Documents
Technical documentation and resources