50-9518-10

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Aries Electronics

CONN IC DIP SOCKET 50POS GOLD

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50-9518-10

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Aries Electronics

CONN IC DIP SOCKET 50POS GOLD

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Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	85	$ 5.68

Description

General part information

50-9518 Series

50 (2 x 25) Pos DIP, 0.9" (22.86mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

Datasheet

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	50-9518-10	50-9518 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Tin	Tin, Gold
Contact Finish Thickness - Mating	10 çin	10 çin
Contact Finish Thickness - Mating	0.25 çm	0.25 çm
Contact Finish Thickness - Post	200 µin	10 - 200 µin
Contact Finish Thickness - Post	5.08 µm	0.25 - 5.08 µm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Current Rating (Amps)	3 A	3 A
Features	Open Frame	Open Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole
Number of Positions or Pins (Grid) [custom]	25	25
Number of Positions or Pins (Grid) [custom]	2	2
Number of Positions or Pins (Grid) [custom]	50	50
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	3.18 mm	3.18 mm
Termination Post Length	0.125 in	0.125 in
Type	22.86 mm	22.86 mm
Type	DIP	DIP
Type	0.9 in	0.9 in

50-9518 Series

CONN IC DIP SOCKET 50POS GOLD

Part	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Termination	Contact Material - Post [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Contact Finish - Post	Contact Finish - Mating	Mounting Type	Type	Type	Type	Housing Material	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Aries Electronics 50-9518-10T	Beryllium Copper	0.1 in	2.54 mm	3 A	UL94 V-0	3.18 mm	0.125 in	Solder	Brass	25	2	50	10 çin	0.25 çm	Open Frame	Tin	Gold	Through Hole	22.86 mm	DIP	0.9 in	Glass Filled, Nylon 4/6, Polyamide (PA46)	2.54 mm	0.1 in	200 µin	5.08 µm
Aries Electronics 50-9518-11H	Beryllium Copper	0.1 in	2.54 mm	3 A	UL94 V-0	3.18 mm	0.125 in	Solder	Brass	25	2	50	10 çin	0.25 çm	Open Frame	Gold	Gold	Through Hole	22.86 mm	DIP	0.9 in	Glass Filled, Nylon 4/6, Polyamide (PA46)	2.54 mm	0.1 in	10 çin	0.25 çm
Aries Electronics 50-9518-10E	Beryllium Copper	0.1 in	2.54 mm	3 A	UL94 V-0	3.18 mm	0.125 in	Solder	Brass	25	2	50	10 çin	0.25 çm	Open Frame	Tin	Gold	Through Hole	22.86 mm	DIP	0.9 in	Glass Filled, Nylon 4/6, Polyamide (PA46)	2.54 mm	0.1 in	200 µin	5.08 µm
Aries Electronics 50-9518-10M	Beryllium Copper	0.1 in	2.54 mm	3 A	UL94 V-0	3.18 mm	0.125 in	Solder	Brass	25	2	50	10 çin	0.25 çm	Open Frame	Tin	Gold	Through Hole	22.86 mm	DIP	0.9 in	Glass Filled, Nylon 4/6, Polyamide (PA46)	2.54 mm	0.1 in	200 µin	5.08 µm
Aries Electronics 50-9518-10	Beryllium Copper	0.1 in	2.54 mm	3 A	UL94 V-0	3.18 mm	0.125 in	Solder	Brass	25	2	50	10 çin	0.25 çm	Open Frame	Tin	Gold	Through Hole	22.86 mm	DIP	0.9 in	Glass Filled, Nylon 4/6, Polyamide (PA46)	2.54 mm	0.1 in	200 µin	5.08 µm
Aries Electronics 50-9518-10H	Beryllium Copper	0.1 in	2.54 mm	3 A	UL94 V-0	3.18 mm	0.125 in	Solder	Brass	25	2	50	10 çin	0.25 çm	Open Frame	Tin	Gold	Through Hole	22.86 mm	DIP	0.9 in	Glass Filled, Nylon 4/6, Polyamide (PA46)	2.54 mm	0.1 in	200 µin	5.08 µm