CONN IC DIP SOCKET 50POS GOLD
| Part | Contact Material - Mating | Pitch - Mating | Pitch - Mating | Current Rating (Amps) | Material Flammability Rating | Termination Post Length | Termination Post Length | Termination | Contact Material - Post [custom] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Contact Finish - Post | Contact Finish - Mating | Mounting Type | Type | Type | Type | Housing Material | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 50-9518-10T | Beryllium Copper | 0.1 in | 2.54 mm | 3 A | UL94 V-0 | 3.18 mm | 0.125 in | Solder | Brass | 25 | 2 | 50 | 10 çin | 0.25 çm | Open Frame | Tin | Gold | Through Hole | 22.86 mm | DIP | 0.9 in | Glass Filled, Nylon 4/6, Polyamide (PA46) | 2.54 mm | 0.1 in | 200 µin | 5.08 µm |
Aries Electronics 50-9518-11H | Beryllium Copper | 0.1 in | 2.54 mm | 3 A | UL94 V-0 | 3.18 mm | 0.125 in | Solder | Brass | 25 | 2 | 50 | 10 çin | 0.25 çm | Open Frame | Gold | Gold | Through Hole | 22.86 mm | DIP | 0.9 in | Glass Filled, Nylon 4/6, Polyamide (PA46) | 2.54 mm | 0.1 in | 10 çin | 0.25 çm |
Aries Electronics 50-9518-10E | Beryllium Copper | 0.1 in | 2.54 mm | 3 A | UL94 V-0 | 3.18 mm | 0.125 in | Solder | Brass | 25 | 2 | 50 | 10 çin | 0.25 çm | Open Frame | Tin | Gold | Through Hole | 22.86 mm | DIP | 0.9 in | Glass Filled, Nylon 4/6, Polyamide (PA46) | 2.54 mm | 0.1 in | 200 µin | 5.08 µm |
Aries Electronics 50-9518-10M | Beryllium Copper | 0.1 in | 2.54 mm | 3 A | UL94 V-0 | 3.18 mm | 0.125 in | Solder | Brass | 25 | 2 | 50 | 10 çin | 0.25 çm | Open Frame | Tin | Gold | Through Hole | 22.86 mm | DIP | 0.9 in | Glass Filled, Nylon 4/6, Polyamide (PA46) | 2.54 mm | 0.1 in | 200 µin | 5.08 µm |
Aries Electronics 50-9518-10 | Beryllium Copper | 0.1 in | 2.54 mm | 3 A | UL94 V-0 | 3.18 mm | 0.125 in | Solder | Brass | 25 | 2 | 50 | 10 çin | 0.25 çm | Open Frame | Tin | Gold | Through Hole | 22.86 mm | DIP | 0.9 in | Glass Filled, Nylon 4/6, Polyamide (PA46) | 2.54 mm | 0.1 in | 200 µin | 5.08 µm |
Aries Electronics 50-9518-10H | Beryllium Copper | 0.1 in | 2.54 mm | 3 A | UL94 V-0 | 3.18 mm | 0.125 in | Solder | Brass | 25 | 2 | 50 | 10 çin | 0.25 çm | Open Frame | Tin | Gold | Through Hole | 22.86 mm | DIP | 0.9 in | Glass Filled, Nylon 4/6, Polyamide (PA46) | 2.54 mm | 0.1 in | 200 µin | 5.08 µm |