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MSP430FR5970IPMR

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Texas Instruments

16 MHZ MCU WITH 32KB FRAM, 2KB SRAM, AES, 12-BIT ADC , COMPARATOR, DMA, UART/SPI/I2C, TIMER

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LQFP (PM)

MSP430FR5970IPMR

Active
Texas Instruments

16 MHZ MCU WITH 32KB FRAM, 2KB SRAM, AES, 12-BIT ADC , COMPARATOR, DMA, UART/SPI/I2C, TIMER

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Description

General part information

MSP430FR5970 Series

This ultra-low-power MSP430FRxx FRAM microcontroller family consists of several devices featuring embedded nonvolatile FRAM, a 16-bit CPU, and different sets of peripherals targeted for various applications. The architecture, FRAM, and peripherals, combined with seven low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a new nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption.

This ultra-low-power MSP430FRxx FRAM microcontroller family consists of several devices featuring embedded nonvolatile FRAM, a 16-bit CPU, and different sets of peripherals targeted for various applications. The architecture, FRAM, and peripherals, combined with seven low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a new nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption.

Technical Specifications

Parameters and characteristics for this part

SpecificationMSP430FR5970IPMR
A/D Channels8 count
A/D Resolution (bits)12 bit
ConnectivityIrDA, USART, I2C, SPI, SCI, UART
Core ProcessorMSP430 CPUXV2
Core Size (Bit Width)16 Bit
Mounting TypeSurface Mount
Number of I/O51
Operating Temperature (Max)85 °C
Operating Temperature (Min)-40 °C
Oscillator TypeInternal
Package / Case64-LQFP
Package Length10 mm
Package Name64-LQFP
Package Width10 mm
PeripheralsPWM, POR, Reset, WDT, Brown-out Detect, DMA
Program Memory Depth32 K
Program Memory Size32 KB
Program Memory TypeFRAM
Program Memory Width8 bit
RAM Size Depth2 K
RAM Size Width8 bit
Speed16 MHz
Voltage - Supply (Vcc/Vdd) Maximum3.6 V
Voltage - Supply (Vcc/Vdd) Minimum1.8 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

MSP430 System ESD Troubleshooting Guide
Getting Started With EEMBC ULPBench on MSP-EXP430FR5969 (Rev. A)
Random Number Generation Using MSP430FR59xx and MSP430FR69xx Microcontrollers
MSP430 Advanced Power Optimizations: ULP Advisor SW and EnergyTrace Technology
Migrating From MSP430F4xx Family to MSP430FR58xx/FR59xx/FR68xx/FR69xx Family (Rev. B)
MSP Code Protection Features
MSP430FR5970 Microcontroller Errata (Rev. U)
Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. A)
General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
FRAM FAQs
System advantages of mixed signal integration
Migration from MSP430 FR58xx, FR59xx, and FR6xx to FR4xx and FR2xx (Rev. B)
Migrating from the MSP430F2xx,G2xx Family to the MSP430FR58xx/FR59xx/68xx/69xx (Rev. E)
Designing With MSP430™ MCUs and Segment LCDs (Rev. A)
MSP430FR597x(1),MSP430FR592x(1) MSP430FR587x(1) Mixed‑Signal Microcontrollers datasheet (Rev. C)
Designing With the MSP430FR58xx, FR59xx, FR68xx, and FR69xx ADC (Rev. A)
MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User's Guide (Rev. P)
MSP430 FRAM Quality and Reliability (Rev. A)
Capacitive Touch and MSP Microcontrollers (Rev. A)
MSP430 System-Level ESD Considerations (Rev. B)
Benchmarking MCU power consumption for ultra-low-power applications
Closing the security gap with TI’s MSP430™ FRAM-based microcontrollers
MSP430 FRAM Technology – How To and Best Practices (Rev. B)
Crypto-Bootloader (CryptoBSL) for MSP430FR59xx and MSP430FR69xx MCUs
Secure In-Field Firmware Updates for MSP MCUs
MSP430 MCUs Development Guide Book (Rev. A)
Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D)
ESD Diode Current Specification (Rev. B)