
TPA701DGNR
Active700-MW, MONO, ANALOG INPUT CLASS-AB AUDIO AMPLIFIER WOTH 1.5 NA QUIESCENT CURRENT
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TPA701DGNR
Active700-MW, MONO, ANALOG INPUT CLASS-AB AUDIO AMPLIFIER WOTH 1.5 NA QUIESCENT CURRENT
Deep-Dive with AI
Technical Specifications
Parameters and characteristics commom to parts in this series
Specification | TPA701DGNR | TPA701 Series |
---|---|---|
Amplifier Type | - | Class AB |
Board Type | - | Fully Populated |
Features | Shutdown, Short-Circuit and Thermal Protection | Shutdown, Short-Circuit and Thermal Protection |
Max Output Power x Channels @ Load | 700 mW | 700 mW |
Max Output Power x Channels @ Load [custom] | 1 | 1 |
Mounting Type | Surface Mount | Surface Mount |
Operating Temperature [Max] | 85 °C | 85 °C |
Operating Temperature [Min] | -40 °C | -40 °C |
Output Type | 1-Channel (Mono) | 1-Channel (Mono) |
Package / Case | Exposed Pad, 8-MSOP, 8-TSSOP | Exposed Pad, 8-MSOP, 8-TSSOP |
Package / Case [x] | 0.118 in | 0.118 in |
Package / Case [x] | 3 mm | 3 mm |
Supplied Contents | - | Board(s) |
Supplier Device Package | 8-HVSSOP | 8-HVSSOP |
Type | Class AB | Class AB |
Utilized IC / Part | - | TPA701 |
Voltage - Supply [Max] | 5.5 V | 5.5 V |
Voltage - Supply [Min] | 2.5 V | 2.5 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
TPA701 Series
700-mW, mono, analog input Class-AB audio amplifier woth 1.5 nA quiescent current
Part | Supplier Device Package | Max Output Power x Channels @ Load | Max Output Power x Channels @ Load [custom] | Package / Case [x] | Package / Case [x] | Package / Case | Features | Operating Temperature [Max] | Operating Temperature [Min] | Type | Output Type | Voltage - Supply [Min] | Voltage - Supply [Max] | Mounting Type | Supplied Contents | Utilized IC / Part | Amplifier Type | Board Type |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments TPA701DGNRThe TPA701 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA701 can deliver 250-mW of continuous power into a BTL 8-load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA701 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.
The TPA701 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA701 can deliver 250-mW of continuous power into a BTL 8-load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA701 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%. | 8-HVSSOP | 700 mW | 1 | 0.118 in | 3 mm | 8-MSOP, 8-TSSOP, Exposed Pad | Short-Circuit and Thermal Protection, Shutdown | 85 °C | -40 °C | Class AB | 1-Channel (Mono) | 2.5 V | 5.5 V | Surface Mount | ||||
8-HVSSOP | 700 mW | 1 | 0.118 in | 3 mm | 8-MSOP, 8-TSSOP, Exposed Pad | Short-Circuit and Thermal Protection, Shutdown | 85 °C | -40 °C | Class AB | 1-Channel (Mono) | 2.5 V | 5.5 V | Surface Mount | |||||
Texas Instruments TPA701DGNThe TPA701 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA701 can deliver 250-mW of continuous power into a BTL 8-load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA701 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.
The TPA701 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA701 can deliver 250-mW of continuous power into a BTL 8-load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA701 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%. | 8-HVSSOP | 700 mW | 1 | 0.118 in | 3 mm | 8-MSOP, 8-TSSOP, Exposed Pad | Short-Circuit and Thermal Protection, Shutdown | 85 °C | -40 °C | Class AB | 1-Channel (Mono) | 2.5 V | 5.5 V | Surface Mount | ||||
Texas Instruments TPA701MSOPEVMTPA701 - 1-Channel (Mono) Output Class AB Audio Amplifier Evaluation Board | 700 mW | 1 | 1-Channel (Mono) | 2.5 V | 5.5 V | Board(s) | TPA701 | Class AB | Fully Populated |
Description
General part information
TPA701 Series
The TPA701 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA701 can deliver 250-mW of continuous power into a BTL 8-load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA701 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.
The TPA701 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA701 can deliver 250-mW of continuous power into a BTL 8-load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA701 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.
Documents
Technical documentation and resources