SMD2S Series

Part	Form Weight	Form	Diameter	Type	Process	Melting Point	Ag Composition	Composition Elements	Composition Formula	Bi Composition	Sn Composition	Cu Composition	Wire Gauge	Flux Type
Chip Quik Inc. SMD2SWLT.047 8OZ	0.5 lb	Spool	0.047 in	Wire Solder	Lead Free	280 °F	0.4 %	Ag Bi Sn	Bi57.6Sn42Ag0.4	57.6 %	42 %
Chip Quik Inc. SMD2SWLF.031 8OZ	0.5 lb	Spool	0.031 in	Wire Solder	Lead Free	441 °F		Cu Sn	Sn99.3Cu0.7		99.3 %	0.7 %	20 AWG 22 SWG	No-Clean Water Soluble
Chip Quik Inc. SMD2SWLF.031 2OZ	2 oz	Spool	0.031 in	Wire Solder	Lead Free	441 °F		Cu Sn	Sn99.3Cu0.7		99.3 %	0.7 %		No-Clean Water Soluble
Chip Quik Inc. SMD2SWLT.047 4OZ	4 oz	Spool	0.047 in	Wire Solder	Lead Free	280 °F	0.4 %	Ag Bi Sn	Bi57.6Sn42Ag0.4	57.6 %	42 %
Chip Quik Inc. SMD2SWLT.040 100G	3.53 oz	Spool	0.04 in	Wire Solder	Lead Free	280 °F	0.4 %	Ag Bi Sn	Bi57.6Sn42Ag0.4	57.6 %	42 %			No-Clean Rosin Activated (RA)
Chip Quik Inc. SMD2SWLT.040 20G	0.7 oz	Spool	0.04 in	Wire Solder	Lead Free	280 °F	0.4 %	Ag Bi Sn	Bi57.6Sn42Ag0.4	57.6 %	42 %			No-Clean Rosin Activated (RA)
Chip Quik Inc. SMD2SWLT.040 10G	0.35 oz	Spool	0.04 in	Wire Solder	Lead Free	280 °F	0.4 %	Ag Bi Sn	Bi57.6Sn42Ag0.4	57.6 %	42 %			No-Clean Rosin Activated (RA)

Pricing

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