Beta
⌘K
SOLDER WIRE SN42/BI57.6/AG0.4 .0
| Part | Form | Form | Form | Diameter [diameter] | Diameter [diameter] | Melting Point [custom] | Melting Point [custom] | Composition | Type | Wire Gauge | Flux Type | Form |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
Chip Quik Inc. | Spool | 0.5 lb 8 oz | 227 g | 1.19 mm | 0.047 in | 138 °C | 280 °F | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Wire Solder | |||
Chip Quik Inc. | Spool | 0.5 lb 8 oz | 227 g | 227 °C | 441 °F | Sn99.3Cu0.7 (99.3/0.7) | Wire Solder | 20 AWG 22 SWG | No-Clean Water Soluble | |||
Chip Quik Inc. | Spool | 2 oz | 56.7 g | 227 °C | 441 °F | Sn99.3Cu0.7 (99.3/0.7) | Wire Solder | No-Clean Water Soluble | ||||
Chip Quik Inc. | Spool | 4 oz | 113.4 g | 1.19 mm | 0.047 in | 138 °C | 280 °F | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Wire Solder | |||
Chip Quik Inc. | Spool | 3.53 oz | 100 g | 1.02 mm | 0.04 in | 138 °C | 280 °F | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Wire Solder | No-Clean Rosin Activated (RA) | ||
Chip Quik Inc. | Spool | 0.7 oz | 20 g | 1.02 mm | 0.04 in | 138 °C | 280 °F | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Wire Solder | No-Clean Rosin Activated (RA) | ||
Chip Quik Inc. | Spool | 0.35 oz | 1.02 mm | 0.04 in | 138 °C | 280 °F | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Wire Solder | No-Clean Rosin Activated (RA) | 10 g |