W25X40CLSNIG TR
ActiveWinbond Electronics
IC FLASH 4MBIT SPI 104MHZ 8SOIC
Deep-Dive with AI
Search across all available documentation for this part.
DocumentsDatasheet
W25X40CLSNIG TR
ActiveWinbond Electronics
IC FLASH 4MBIT SPI 104MHZ 8SOIC
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | W25X40CLSNIG TR | W25X40 Series |
|---|---|---|
| - | - | |
| Clock Frequency | 104 MHz | 75 - 104 MHz |
| Memory Format | FLASH | FLASH |
| Memory Interface | SPI | SPI |
| Memory Organization | 512 K | 512 K |
| Memory Size | 512 kb | 512 kb |
| Memory Type | Non-Volatile | Non-Volatile |
| Mounting Type | Surface Mount | Surface Mount, Through Hole |
| Operating Temperature [Max] | 85 °C | 85 °C |
| Operating Temperature [Min] | -40 °C | -40 °C |
| Package / Case | 8-SOIC | 8-SOIC, 8-WDFN Exposed Pad, 8-DIP, 8-UFDFN Exposed Pad |
| Package / Case | - | 0.3 in |
| Package / Case | - | 7.62 mm |
| Package / Case [x] | 0.154 in | 0.154 - 0.209 " |
| Package / Case [y] | 3.9 mm | 3.9 - 5.3 mm |
| Supplier Device Package | 8-SOIC | 8-SOIC, 8-WSON (6x5), 8-PDIP, 8-VSOP, 8-USON (2x3) |
| Technology | FLASH | FLASH |
| Voltage - Supply [Max] | 3.6 V | 3.6 V |
| Voltage - Supply [Min] | 2.3 V | 2.3 - 2.7 V |
| Write Cycle Time - Word, Page | 800 µs | 3 - 800 ms |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 0.53 | |
| 10 | $ 0.47 | |||
| 25 | $ 0.45 | |||
| 50 | $ 0.43 | |||
| 100 | $ 0.42 | |||
| 250 | $ 0.40 | |||
| 500 | $ 0.38 | |||
| 1000 | $ 0.37 | |||
| Digi-Reel® | 1 | $ 0.53 | ||
| 10 | $ 0.47 | |||
| 25 | $ 0.45 | |||
| 50 | $ 0.43 | |||
| 100 | $ 0.42 | |||
| 250 | $ 0.40 | |||
| 500 | $ 0.38 | |||
| 1000 | $ 0.37 | |||
| Tape & Reel (TR) | 2500 | $ 0.35 | ||
| 5000 | $ 0.34 | |||
| 7500 | $ 0.33 | |||
| 12500 | $ 0.32 | |||
| 17500 | $ 0.32 | |||
| 25000 | $ 0.31 | |||
W25X40 Series
NOR FLASH SERIAL (SPI, DUAL SPI) 2.5V/3V/3.3V 4M-BIT 512K X 8 8NS 8-PIN SOIC T/R
| Part | Memory Format | Write Cycle Time - Word, Page | Memory Organization | Clock Frequency | Voltage - Supply [Min] | Voltage - Supply [Max] | Mounting Type | Package / Case [y] | Package / Case | Package / Case [x] | Technology | Supplier Device Package | Operating Temperature [Max] | Operating Temperature [Min] | Memory Size | Memory Interface | Memory Type | Package / Case | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics W25X40CLSSIG TR | |||||||||||||||||||
Winbond Electronics W25X40VSSIG T&R | FLASH | 3 ms | 512 K | 75 MHz | 2.7 V | 3.6 V | Surface Mount | 5.3 mm | 8-SOIC | 0.209 " | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40VZPIG T&R | FLASH | 3 ms | 512 K | 75 MHz | 2.7 V | 3.6 V | Surface Mount | 8-WDFN Exposed Pad | FLASH | 8-WSON (6x5) | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||||
Winbond Electronics W25X40AVSNIG | FLASH | 3 ms | 512 K | 100 MHz | 2.7 V | 3.6 V | Surface Mount | 3.9 mm | 8-SOIC | 0.154 in | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40CVSSIG | FLASH | 800 µs | 512 K | 104 MHz | 2.7 V | 3.6 V | Surface Mount | 5.3 mm | 8-SOIC | 0.209 " | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40CLDAIG TR | FLASH | 800 µs | 512 K | 104 MHz | 2.3 V | 3.6 V | Through Hole | 8-DIP | FLASH | 8-PDIP | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | 0.3 in | 7.62 mm | ||
Winbond Electronics W25X40VSSIG | FLASH | 3 ms | 512 K | 75 MHz | 2.7 V | 3.6 V | Surface Mount | 5.3 mm | 8-SOIC | 0.209 " | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40CLSVIG | FLASH | 800 µs | 512 K | 104 MHz | 2.3 V | 3.6 V | Surface Mount | 3.9 mm | 8-SOIC | 0.154 in | FLASH | 8-VSOP | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40CLZPIG TR | FLASH | 800 µs | 512 K | 104 MHz | 2.3 V | 3.6 V | Surface Mount | 8-WDFN Exposed Pad | FLASH | 8-WSON (6x5) | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||||
Winbond Electronics W25X40BVZPIG | FLASH | 3 ms | 512 K | 104 MHz | 2.7 V | 3.6 V | Surface Mount | 8-WDFN Exposed Pad | FLASH | 8-WSON (6x5) | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||||
Winbond Electronics W25X40BVSNIG | FLASH | 3 ms | 512 K | 104 MHz | 2.7 V | 3.6 V | Surface Mount | 3.9 mm | 8-SOIC | 0.154 in | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40CLSNIG | FLASH | 800 µs | 512 K | 104 MHz | 2.3 V | 3.6 V | Surface Mount | 3.9 mm | 8-SOIC | 0.154 in | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40CLSSIG | FLASH | 800 µs | 512 K | 104 MHz | 2.3 V | 3.6 V | Surface Mount | 5.3 mm | 8-SOIC | 0.209 " | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40VSNIG | FLASH | 3 ms | 512 K | 75 MHz | 2.7 V | 3.6 V | Surface Mount | 3.9 mm | 8-SOIC | 0.154 in | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40AVSSIG | FLASH | 3 ms | 512 K | 100 MHz | 2.7 V | 3.6 V | Surface Mount | 5.3 mm | 8-SOIC | 0.209 " | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40AVZPIG | FLASH | 3 ms | 512 K | 100 MHz | 2.7 V | 3.6 V | Surface Mount | 8-WDFN Exposed Pad | FLASH | 8-WSON (6x5) | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||||
Winbond Electronics W25X40BVSSIG | FLASH | 3 ms | 512 K | 104 MHz | 2.7 V | 3.6 V | Surface Mount | 5.3 mm | 8-SOIC | 0.209 " | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40CLSVIG | |||||||||||||||||||
Winbond Electronics W25X40CLSVIG TR | FLASH | 800 µs | 512 K | 104 MHz | 2.3 V | 3.6 V | Surface Mount | 3.9 mm | 8-SOIC | 0.154 in | FLASH | 8-VSOP | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40CLSSIG TR | FLASH | 800 µs | 512 K | 104 MHz | 2.3 V | 3.6 V | Surface Mount | 5.3 mm | 8-SOIC | 0.209 " | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40BVDAIG | FLASH | 3 ms | 512 K | 104 MHz | 2.7 V | 3.6 V | Through Hole | 8-DIP | FLASH | 8-PDIP | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | 0.3 in | 7.62 mm | ||
Winbond Electronics W25X40VSNIG T&R | FLASH | 3 ms | 512 K | 75 MHz | 2.7 V | 3.6 V | Surface Mount | 3.9 mm | 8-SOIC | 0.154 in | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40CLUXIG TR | FLASH | 800 µs | 512 K | 104 MHz | 2.3 V | 3.6 V | Surface Mount | 8-UFDFN Exposed Pad | FLASH | 8-USON (2x3) | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||||
Winbond Electronics W25X40VZPIG | FLASH | 3 ms | 512 K | 75 MHz | 2.7 V | 3.6 V | Surface Mount | 8-WDFN Exposed Pad | FLASH | 8-WSON (6x5) | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||||
Winbond Electronics W25X40CLSNIG TR | FLASH | 800 µs | 512 K | 104 MHz | 2.3 V | 3.6 V | Surface Mount | 3.9 mm | 8-SOIC | 0.154 in | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40AVDAIZ | FLASH | 3 ms | 512 K | 100 MHz | 2.7 V | 3.6 V | Through Hole | 8-DIP | FLASH | 8-PDIP | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | 0.3 in | 7.62 mm |
Description
General part information
W25X40 Series
FLASH Memory IC 4Mbit SPI 104 MHz 8-SOIC
Documents
Technical documentation and resources