NOR FLASH SERIAL (SPI, DUAL SPI) 2.5V/3V/3.3V 4M-BIT 512K X 8 8NS 8-PIN SOIC T/R
| Part | Memory Format | Write Cycle Time - Word, Page | Memory Organization | Clock Frequency | Voltage - Supply [Min] | Voltage - Supply [Max] | Mounting Type | Package / Case [y] | Package / Case | Package / Case [x] | Technology | Supplier Device Package | Operating Temperature [Max] | Operating Temperature [Min] | Memory Size | Memory Interface | Memory Type | Package / Case | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics W25X40CLSSIG TR | |||||||||||||||||||
Winbond Electronics W25X40VSSIG T&R | FLASH | 3 ms | 512 K | 75 MHz | 2.7 V | 3.6 V | Surface Mount | 5.3 mm | 8-SOIC | 0.209 " | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40VZPIG T&R | FLASH | 3 ms | 512 K | 75 MHz | 2.7 V | 3.6 V | Surface Mount | 8-WDFN Exposed Pad | FLASH | 8-WSON (6x5) | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||||
Winbond Electronics W25X40AVSNIG | FLASH | 3 ms | 512 K | 100 MHz | 2.7 V | 3.6 V | Surface Mount | 3.9 mm | 8-SOIC | 0.154 in | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40CVSSIG | FLASH | 800 µs | 512 K | 104 MHz | 2.7 V | 3.6 V | Surface Mount | 5.3 mm | 8-SOIC | 0.209 " | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40CLDAIG TR | FLASH | 800 µs | 512 K | 104 MHz | 2.3 V | 3.6 V | Through Hole | 8-DIP | FLASH | 8-PDIP | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | 0.3 in | 7.62 mm | ||
Winbond Electronics W25X40VSSIG | FLASH | 3 ms | 512 K | 75 MHz | 2.7 V | 3.6 V | Surface Mount | 5.3 mm | 8-SOIC | 0.209 " | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40CLSVIG | FLASH | 800 µs | 512 K | 104 MHz | 2.3 V | 3.6 V | Surface Mount | 3.9 mm | 8-SOIC | 0.154 in | FLASH | 8-VSOP | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40CLZPIG TR | FLASH | 800 µs | 512 K | 104 MHz | 2.3 V | 3.6 V | Surface Mount | 8-WDFN Exposed Pad | FLASH | 8-WSON (6x5) | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||||
Winbond Electronics W25X40BVZPIG | FLASH | 3 ms | 512 K | 104 MHz | 2.7 V | 3.6 V | Surface Mount | 8-WDFN Exposed Pad | FLASH | 8-WSON (6x5) | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||||
Winbond Electronics W25X40BVSNIG | FLASH | 3 ms | 512 K | 104 MHz | 2.7 V | 3.6 V | Surface Mount | 3.9 mm | 8-SOIC | 0.154 in | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40CLSNIG | FLASH | 800 µs | 512 K | 104 MHz | 2.3 V | 3.6 V | Surface Mount | 3.9 mm | 8-SOIC | 0.154 in | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40CLSSIG | FLASH | 800 µs | 512 K | 104 MHz | 2.3 V | 3.6 V | Surface Mount | 5.3 mm | 8-SOIC | 0.209 " | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40VSNIG | FLASH | 3 ms | 512 K | 75 MHz | 2.7 V | 3.6 V | Surface Mount | 3.9 mm | 8-SOIC | 0.154 in | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40AVSSIG | FLASH | 3 ms | 512 K | 100 MHz | 2.7 V | 3.6 V | Surface Mount | 5.3 mm | 8-SOIC | 0.209 " | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40AVZPIG | FLASH | 3 ms | 512 K | 100 MHz | 2.7 V | 3.6 V | Surface Mount | 8-WDFN Exposed Pad | FLASH | 8-WSON (6x5) | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||||
Winbond Electronics W25X40BVSSIG | FLASH | 3 ms | 512 K | 104 MHz | 2.7 V | 3.6 V | Surface Mount | 5.3 mm | 8-SOIC | 0.209 " | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40CLSVIG | |||||||||||||||||||
Winbond Electronics W25X40CLSVIG TR | FLASH | 800 µs | 512 K | 104 MHz | 2.3 V | 3.6 V | Surface Mount | 3.9 mm | 8-SOIC | 0.154 in | FLASH | 8-VSOP | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40CLSSIG TR | FLASH | 800 µs | 512 K | 104 MHz | 2.3 V | 3.6 V | Surface Mount | 5.3 mm | 8-SOIC | 0.209 " | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40BVDAIG | FLASH | 3 ms | 512 K | 104 MHz | 2.7 V | 3.6 V | Through Hole | 8-DIP | FLASH | 8-PDIP | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | 0.3 in | 7.62 mm | ||
Winbond Electronics W25X40VSNIG T&R | FLASH | 3 ms | 512 K | 75 MHz | 2.7 V | 3.6 V | Surface Mount | 3.9 mm | 8-SOIC | 0.154 in | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40CLUXIG TR | FLASH | 800 µs | 512 K | 104 MHz | 2.3 V | 3.6 V | Surface Mount | 8-UFDFN Exposed Pad | FLASH | 8-USON (2x3) | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||||
Winbond Electronics W25X40VZPIG | FLASH | 3 ms | 512 K | 75 MHz | 2.7 V | 3.6 V | Surface Mount | 8-WDFN Exposed Pad | FLASH | 8-WSON (6x5) | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||||
Winbond Electronics W25X40CLSNIG TR | FLASH | 800 µs | 512 K | 104 MHz | 2.3 V | 3.6 V | Surface Mount | 3.9 mm | 8-SOIC | 0.154 in | FLASH | 8-SOIC | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | ||
Winbond Electronics W25X40AVDAIZ | FLASH | 3 ms | 512 K | 100 MHz | 2.7 V | 3.6 V | Through Hole | 8-DIP | FLASH | 8-PDIP | 85 °C | -40 °C | 512 kb | SPI | Non-Volatile | 0.3 in | 7.62 mm |