HSEC8-137-01-S-DV-A-BL-TR

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Samtec Inc.

CONN EDGE DUAL FMALE 74POS 0.031

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HSEC8-137-01-S-DV-A-BL-TR

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Samtec Inc.

CONN EDGE DUAL FMALE 74POS 0.031

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	HSEC8-137-01-S-DV-A-BL-TR

Card Thickness	0.062 in
Card Thickness	1.57 mm
Card Type	Non Specified - Dual Edge
Color	Black
Contact Finish	Gold
Contact Finish Thickness	0.76 Ám
Contact Finish Thickness	30 Áin
Contact Material	Beryllium Copper
Contact Type	Cantilever
Features	Board Guide, Board Lock
Gender	Female
Material - Insulation	Liquid Crystal Polymer (LCP)
Mounting Type	Surface Mount
Number of Positions	74
Number of Positions/Bay/Row [custom]	37
Number of Positions/Bay/Row [custom]	37
Number of Positions/Bay/Row [custom]	37
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch [x]	0.8 mm
Pitch [x]	0.031 in
Read Out	Dual
Termination	Solder

HSEC8-137 Series

Part	Operating Temperature [Min]	Operating Temperature [Max]	Card Thickness	Card Thickness	Mounting Type	Number of Rows	Contact Finish Thickness	Contact Finish Thickness	Contact Type	Number of Positions/Bay/Row [custom]	Number of Positions/Bay/Row [custom]	Number of Positions/Bay/Row [custom]	Contact Material	Material - Insulation	Color	Number of Positions	Pitch [x]	Pitch [x]	Termination	Features	Contact Finish	Card Type	Gender	Read Out
Samtec Inc. HSEC8-137-01-L-DV-A-WT-K-TR	-55 °C	125 °C	0.062 in	1.57 mm	Surface Mount	2	10 Áin	0.25 Ám	Cantilever	37	37	37	Beryllium Copper	Liquid Crystal Polymer (LCP)	Black	74	0.8 mm	0.031 in	Solder	Board Guide Solder Retention	Gold	Non Specified - Dual Edge	Female	Dual
Samtec Inc. HSEC8-137-01-L-DV-A-K	-55 °C	125 °C	0.062 in	1.57 mm	Surface Mount	2	10 Áin	0.25 Ám	Cantilever	37	37	37	Beryllium Copper	Liquid Crystal Polymer (LCP)	Black	74	0.8 mm	0.031 in	Solder	Board Guide	Gold	Non Specified - Dual Edge	Female	Dual
Samtec Inc. HSEC8-137-01-S-DV-A-BL-K-TR	-55 °C	125 °C	0.062 in	1.57 mm	Surface Mount	2	30 Áin	0.76 Ám	Cantilever	37	37	37	Beryllium Copper	Liquid Crystal Polymer (LCP)	Black	74	0.8 mm	0.031 in	Solder	Board Guide Board Lock	Gold	Non Specified - Dual Edge	Female	Dual
Samtec Inc. HSEC8-137-01-SM-DV-A-TR	-55 °C	125 °C	0.062 in	1.57 mm	Surface Mount	2	30 Áin	0.76 Ám	Cantilever	37	37	37	Beryllium Copper	Liquid Crystal Polymer (LCP)	Black	74	0.8 mm	0.031 in	Solder	Board Guide	Gold	Non Specified - Dual Edge	Female	Dual
Samtec Inc. HSEC8-137-01-S-DV-A-BL-L-K-TR	-55 °C	125 °C	0.062 in	1.57 mm	Surface Mount	2	30 Áin	0.76 Ám	Cantilever	37	37	37	Beryllium Copper	Liquid Crystal Polymer (LCP)	Black	74	0.8 mm	0.031 in	Solder	Board Guide Board Lock Latches	Gold	Non Specified - Dual Edge	Female	Dual
Samtec Inc. HSEC8-137-01-L-DV-A	-55 °C	125 °C	0.062 in	1.57 mm	Surface Mount	2	10 Áin	0.25 Ám	Cantilever	37	37	37	Beryllium Copper	Liquid Crystal Polymer (LCP)	Black	74	0.8 mm	0.031 in	Solder	Board Guide Locking Ramp	Gold	Non Specified - Dual Edge	Female	Dual
Samtec Inc. HSEC8-137-01-S-DV-A-BL-TR	-55 °C	125 °C	0.062 in	1.57 mm	Surface Mount	2	30 Áin	0.76 Ám	Cantilever	37	37	37	Beryllium Copper	Liquid Crystal Polymer (LCP)	Black	74	0.8 mm	0.031 in	Solder	Board Guide Board Lock	Gold	Non Specified - Dual Edge	Female	Dual

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tape & Reel (TR)	125	$ 5.45

Description

General part information

HSEC8-137 Series

74 Position Female Connector Non Specified - Dual Edge Gold 0.031" (0.80mm) Black

Documents

Technical documentation and resources