
TSM-114-01-F-DV-P
ActiveSamtec Inc.
CONN HEADER SMD 28POS 2.54MM
Deep-Dive with AI
Search across all available documentation for this part.
DocumentsDatasheet

TSM-114-01-F-DV-P
ActiveSamtec Inc.
CONN HEADER SMD 28POS 2.54MM
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | TSM-114-01-F-DV-P |
|---|---|
| Connector Type | Cuttable, Header |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 3 µin |
| Contact Finish Thickness - Mating | 0.076 µm |
| Contact Length - Mating | 5.84 mm |
| Contact Length - Mating [x] | 0.23 in |
| Contact Material | Phosphor Bronze |
| Contact Shape | Square |
| Contact Type | Male Pin |
| Fastening Type | Push-Pull |
| Features | Pick and Place |
| Insulation Color | Black |
| Insulation Height | 0.1 in |
| Insulation Height | 2.54 mm |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Surface Mount |
| Number of Positions | 28 |
| Number of Positions Loaded | All |
| Number of Rows | 2 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Row Spacing - Mating [x] | 2.54 mm |
| Row Spacing - Mating [x] | 0.1 in |
| Shrouding | Unshrouded |
| Style | Board to Board, Cable |
| Termination | Solder |
TSM-114 Series
...
| Part | Contact Shape | Insulation Color | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Operating Temperature [Min] | Operating Temperature [Max] | Contact Material | Contact Finish - Post | Mounting Type | Contact Length - Mating [x] | Contact Length - Mating | Insulation Height | Insulation Height | Shrouding | Insulation Material | Termination | Connector Type | Number of Positions Loaded | Fastening Type | Contact Type | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Number of Positions | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Rows | Style | Contact Length - Mating | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Length - Mating [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Square | Black | 2.54 mm | 0.1 in | -55 °C | 125 °C | Phosphor Bronze | Tin | Surface Mount | 0.23 in | 5.84 mm | 0.1 in | 2.54 mm | Unshrouded | Liquid Crystal Polymer (LCP) | Solder | Cuttable Header | All | Push-Pull | Male Pin | Gold | 0.1 in | 2.54 mm | 28 | UL94 V-0 | 10 çin | 0.25 çm | 2 | Board to Board Cable | |||||
Samtec Inc. | Square | Black | 2.54 mm | 0.1 in | -55 °C | 105 ░C | Phosphor Bronze | Tin | Surface Mount | 8.13 mm | 0.1 in | 2.54 mm | Unshrouded | Liquid Crystal Polymer (LCP) | Solder | Cuttable Header | All | Push-Pull | Male Pin | 0.1 in | 2.54 mm | 28 | UL94 V-0 | 2 | Board to Board Cable | 0.32 in | ||||||||
Samtec Inc. | Square | Black | 2.54 mm | 0.1 in | -55 °C | 105 ░C | Phosphor Bronze | Tin | Surface Mount | 8.13 mm | 0.1 in | 2.54 mm | Unshrouded | Liquid Crystal Polymer (LCP) | Solder | Cuttable Header | All | Push-Pull | Male Pin | 0.1 in | 2.54 mm | 28 | UL94 V-0 | 2 | Board to Board Cable | 0.32 in | ||||||||
Samtec Inc. | Square | Black | 2.54 mm | 0.1 in | -55 °C | 125 °C | Phosphor Bronze | Tin | Surface Mount | 0.23 in | 5.84 mm | 0.1 in | 2.54 mm | Unshrouded | Liquid Crystal Polymer (LCP) | Solder | Cuttable Header | All | Push-Pull | Male Pin | Gold | 0.1 in | 2.54 mm | 28 | UL94 V-0 | 10 çin | 0.25 çm | 2 | Board to Board Cable | Board Guide | ||||
Samtec Inc. | Square | Black | 2.54 mm | 0.1 in | -55 °C | 125 °C | Phosphor Bronze | Tin | Surface Mount | 0.23 in | 5.84 mm | 0.1 in | 2.54 mm | Unshrouded | Liquid Crystal Polymer (LCP) | Solder | Cuttable Header | All | Push-Pull | Male Pin | Gold | 0.1 in | 2.54 mm | 28 | UL94 V-0 | 3 µin | 0.076 µm | 2 | Board to Board Cable | Pick and Place | ||||
Samtec Inc. | Square | Black | 2.54 mm | 0.1 in | -55 °C | 125 °C | Phosphor Bronze | Tin | Surface Mount | 0.23 in | 5.84 mm | 0.1 in | 2.54 mm | Unshrouded | Liquid Crystal Polymer (LCP) | Solder | Cuttable Header | All | Push-Pull | Male Pin | Gold | 0.1 in | 2.54 mm | 28 | UL94 V-0 | 30 Áin | 0.76 Ám | 2 | Board to Board Cable | Pick and Place | ||||
Samtec Inc. | Square | Black | 2.54 mm | 0.1 in | -55 °C | 125 °C | Phosphor Bronze | Gold | Board Edge Straddle Mount | 8.13 mm | Unshrouded | Liquid Crystal Polymer (LCP) | Solder | Header | All | Push-Pull | Male Pin | Gold | 0.1 in | 2.54 mm | 28 | UL94 V-0 | 10 çin | 0.25 çm | 2 | Board to Board Cable | 0.32 in | 3 µin | 0.076 µm | |||||
Samtec Inc. | Square | Black | 2.54 mm | 0.1 in | -55 °C | 105 ░C | Phosphor Bronze | Tin | Surface Mount | 8.13 mm | 0.1 in | 2.54 mm | Unshrouded | Liquid Crystal Polymer (LCP) | Solder | Cuttable Header | All | Push-Pull | Male Pin | 0.1 in | 2.54 mm | 28 | UL94 V-0 | 2 | Board to Board Cable | 0.32 in | Board Guide | |||||||
Samtec Inc. | Square | Black | 2.54 mm | 0.1 in | -55 °C | 125 °C | Phosphor Bronze | Tin | Surface Mount | 0.075 in | 0.1 in | 2.54 mm | Unshrouded | Liquid Crystal Polymer (LCP) | Solder | Cuttable Header | All | Push-Pull | Male Pin | Gold | 0.1 in | 2.54 mm | 28 | UL94 V-0 | 3 µin | 0.076 µm | 2 | Board to Board Cable | Board Guide | 1.9 mm | ||||
Samtec Inc. | Square | Black | -55 °C | 125 °C | Phosphor Bronze | Tin | Surface Mount Right Angle | 0.23 in | 5.84 mm | 0.12 in | 3.05 mm | Unshrouded | Liquid Crystal Polymer (LCP) | Solder | Header | All | Push-Pull | Male Pin | Gold | 0.1 in | 2.54 mm | 14 | UL94 V-0 | 30 Áin | 0.76 Ám | 1 | Board to Board Cable | Board Guide Pick and Place |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 3.34 | |
Description
General part information
TSM-114 Series
Connector Header Surface Mount 28 position 0.100" (2.54mm)
Documents
Technical documentation and resources