PH3N-76.2-25.4-0.062-1A

Obsolete

t-Global Technology

PH3N NANO 76.2X25.4X0.062MM

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Obsolete

t-Global Technology

PH3N NANO 76.2X25.4X0.062MM

Technical Specifications

Parameters and characteristics for this part

Part	Material	Shape	Material Finish	Width	Width [x]	Fin Height	Fin Height	Type	Package Cooled	Attachment Method	Shelf Life	Length	Length	Fin Height [z]	Fin Height [z]	Width [y]	Width [y]
t-Global Technology PH3N-76.2-25.4-0.062-1A	Copper	Rectangular	Polyester	25.4 mm	1 in	0.002 in	0.06 mm	Heat Spreader	ASIC BGA CPU LGA	Adhesive	12 Months	3 in	76.2 mm
t-Global Technology PH3N-76.2-12.7-0.07-1A	Copper	Rectangular	Polyester					Heat Spreader	ASIC BGA CPU LGA	Adhesive	12 Months	3 in	76.2 mm	0.003 in	0.07 mm
t-Global Technology PH3N-76.2-19.1-0.07-1A	Copper	Rectangular	Polyester					Heat Spreader	ASIC BGA CPU LGA	Adhesive	12 Months	3 in	76.2 mm	0.003 in	0.07 mm	0.75 in	19.05 mm
t-Global Technology PH3N-76.2-19.1-0.062-1A	Copper	Rectangular	Polyester			0.002 in	0.06 mm	Heat Spreader	ASIC BGA CPU LGA	Adhesive	12 Months	3 in	76.2 mm			0.75 in	19.05 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader

Technical documentation and resources