
SDL-129-T-11
UnknownSamtec Inc.
CONN RCPT 58POS 0.1 GOLD PCB
Deep-Dive with AI
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SDL-129-T-11
UnknownSamtec Inc.
CONN RCPT 58POS 0.1 GOLD PCB
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | SDL-129-T-11 |
|---|---|
| Connector Type | Receptacle |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 30 Áin |
| Contact Finish Thickness - Mating | 0.76 Ám |
| Contact Length - Post | 0.108 in |
| Contact Length - Post | 2.75 mm |
| Contact Material | Beryllium Copper |
| Contact Shape | Circular |
| Contact Type | Female Socket |
| Fastening Type | Push-Pull |
| Insulation Color | Black |
| Insulation Height | 0.132 in |
| Insulation Height | 3.35 mm |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Mounting Type | Through Hole |
| Number of Positions | 58 |
| Number of Positions Loaded | All |
| Number of Rows | 2 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Row Spacing - Mating [x] | 2.54 mm |
| Row Spacing - Mating [x] | 0.1 in |
| Termination | Solder |
SDL-129 Series
| Part | Contact Length - Post | Contact Length - Post | Insulation Color | Fastening Type | Operating Temperature [Max] | Operating Temperature [Min] | Contact Shape | Number of Rows | Termination | Contact Material | Insulation Material | Contact Finish - Post | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Contact Type | Number of Positions | Connector Type | Number of Positions Loaded | Pitch - Mating | Pitch - Mating | Insulation Height | Insulation Height | Mounting Type | Contact Length - Post [x] | Contact Length - Post [x] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Insulation Height [z] | Insulation Height [z] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.108 in | 2.75 mm | Black | Push-Pull | 105 ░C | -55 °C | Circular | 2 | Solder | Beryllium Copper | Liquid Crystal Polymer (LCP) | Tin | 2.54 mm | 0.1 in | Female Socket | 58 | Receptacle | All | 0.1 in | 2.54 mm | 0.132 in | 3.35 mm | Through Hole | |||||||||
Samtec Inc. | Black | Push-Pull | 125 °C | -55 °C | Circular | 2 | Solder | Beryllium Copper | Liquid Crystal Polymer (LCP) | Gold | 2.54 mm | 0.1 in | Female Socket | 58 | Receptacle | All | 0.1 in | 2.54 mm | Through Hole | 2.41 mm | 0.095 in | 30 Áin | 0.76 Ám | Gold | 10 çin | 0.25 çm | 0.095 in | 2.41 mm | ||||
Samtec Inc. | 0.108 in | 2.75 mm | Black | Push-Pull | 125 °C | -55 °C | Circular | 2 | Solder | Beryllium Copper | Liquid Crystal Polymer (LCP) | 2.54 mm | 0.1 in | Female Socket | 58 | Receptacle | All | 0.1 in | 2.54 mm | 0.132 in | 3.35 mm | Through Hole | 30 Áin | 0.76 Ám | Gold |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
Description
General part information
SDL-129 Series
58 Position Receptacle Connector 0.100" (2.54mm) Through Hole Gold
Documents
Technical documentation and resources