SDL-129 Series
Manufacturer: Samtec Inc.
CONN RCPT 58POS 0.1 TIN PCB
| Part | Mounting Type | Contact Type | Contact Finish - Mating | Fastening Type | Contact Finish - Post | Insulation Color | Number of Rows | Number of Positions Loaded | Contact Length - Post | Style | Number of Positions | Termination | Connector Type | Pitch - Mating | Insulation Height | Operating Temperature (Min) | Operating Temperature (Max) | Row Spacing - Mating | Contact Material | Contact Shape | Insulation Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Through Hole | Female Socket | Tin | Push-Pull | Tin | Black | 2 | All | 0.108 in | Board | 58 | Solder | Receptacle | 0.1 in | 0.132 in | -55 °C | 105 °C | 0.1 in | Beryllium Copper | Circular | Liquid Crystal Polymer (LCP) | ||
Samtec Inc. | Through Hole | Female Socket | Tin | Push-Pull | Tin | Black | 2 | All | 0.095 in | Board | 58 | Solder | Receptacle | 0.1 in | 0.095 in | -55 °C | 105 °C | 0.1 in | Beryllium Copper | Circular | Liquid Crystal Polymer (LCP) | ||
Samtec Inc. | Through Hole | Female Socket | Gold | Push-Pull | Gold | Black | 2 | All | 0.095 in | Board | 58 | Solder | Receptacle | 0.1 in | 0.095 in | -55 °C | 125 °C | 0.1 in | Beryllium Copper | Circular | Liquid Crystal Polymer (LCP) | 30 µin | 10 µin |
Samtec Inc. | Through Hole | Female Socket | Gold | Push-Pull | Black | 2 | All | 0.108 in | Board | 58 | Solder | Receptacle | 0.1 in | 0.132 in | -55 °C | 125 °C | 0.1 in | Beryllium Copper | Circular | Liquid Crystal Polymer (LCP) | 30 µin | ||
Samtec Inc. | Through Hole | Female Socket | Gold | Push-Pull | Gold | Black | 2 | All | 0.082 in | Board | 58 | Solder | Receptacle | 0.1 in | 0.083 in | -55 °C | 125 °C | 0.1 in | Beryllium Copper | Circular | Liquid Crystal Polymer (LCP) | 30 µin | 10 µin |