SMDAL200

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Chip Quik Inc.

ALUMINUM SOLDER PASTE WATER-SOLU

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Active

Chip Quik Inc.

ALUMINUM SOLDER PASTE WATER-SOLU

Technical Specifications

Parameters and characteristics for this part

ALUMINUM SOLDER PASTE WATER-SOLU

Part	Flux Type	Mesh Type	Form	Form	Form	Shelf Life	Type	Shelf Life Start	Melting Point [custom]	Melting Point [custom]	Composition
Chip Quik Inc. SMDAL200	Water Soluble	3	Jar	7.05 oz	200 g	12 Months	Solder Paste	Date of Manufacture	221 °C	430 °F	Sn96.5Ag3.5 (96.5/3.5)

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 74.55

General part information

Lead Free Water Soluble Solder Paste Sn96.5Ag3.5 (96.5/3.5) Jar, 7.05 oz (200g)

Technical documentation and resources