ALUMINUM SOLDER PASTE WATER-SOLU
| Part | Flux Type | Mesh Type | Form | Form | Form | Shelf Life | Type | Shelf Life Start | Melting Point [custom] | Melting Point [custom] | Composition |
|---|---|---|---|---|---|---|---|---|---|---|---|
Chip Quik Inc. SMDAL200 | Water Soluble | 3 | Jar | 7.05 oz | 200 g | 12 Months | Solder Paste | Date of Manufacture | 221 °C | 430 °F | Sn96.5Ag3.5 (96.5/3.5) |