W66CM2NQUAFJ TR

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Winbond Electronics

IC DRAM 4GBIT LVSTL 11 200WFBGA

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Winbond Electronics

IC DRAM 4GBIT LVSTL 11 200WFBGA

Technical Specifications

Parameters and characteristics commom to parts in this series

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tape & Reel (TR)	2500	$ 7.67

IC DRAM 4GBIT LVSTL 11 200WFBGA

Part	Supplier Device Package	Mounting Type	Memory Type	Package / Case	Memory Format	Technology	Clock Frequency	Write Cycle Time - Word, Page	Operating Temperature [Max]	Operating Temperature [Min]	Voltage - Supply [Min]	Voltage - Supply [Max]	Memory Organization	Memory Size
Winbond Electronics W66CM2NQUAGI TR	200-WFBGA (10x14.5)	Surface Mount	Volatile	200-WFBGA	DRAM	SDRAM - Mobile LPDDR4X	1866 MHz	18 ns	95 °C	-40 °C	1.06 V, 1.7 V	1.17 V, 1.95 V	256 M	512 kb
Winbond Electronics W66CM2NQUAGJ	200-WFBGA (10x14.5)	Surface Mount	Volatile	200-WFBGA	DRAM	SDRAM - Mobile LPDDR4X	1866 MHz	18 ns	105 °C	-40 °C	1.06 V, 1.7 V	1.17 V, 1.95 V	128 M	512 kb
Winbond Electronics W66CM2NQUAFJ TR	200-WFBGA (10x14.5)	Surface Mount	Volatile	200-WFBGA	DRAM	SDRAM - Mobile LPDDR4X	1.6 GHz	18 ns	105 °C	-40 °C	1.06 V, 1.7 V	1.17 V, 1.95 V	128 M	512 kb
Winbond Electronics W66CM2NQUAHJ TR	200-WFBGA (10x14.5)	Surface Mount	Volatile	200-WFBGA	DRAM	SDRAM - Mobile LPDDR4X	2.133 GHz	18 ns	105 °C	-40 °C	1.06 V, 1.7 V	1.17 V, 1.95 V	128 M	512 kb

General part information

SDRAM - Mobile LPDDR4X Memory IC 4Gbit LVSTL_11 1.6 GHz 3.5 ns 200-WFBGA (10x14.5)

Technical documentation and resources