IC DRAM 4GBIT LVSTL 11 200WFBGA
Part | Supplier Device Package | Mounting Type | Memory Type | Package / Case | Memory Format | Technology | Clock Frequency | Write Cycle Time - Word, Page | Operating Temperature [Max] | Operating Temperature [Min] | Voltage - Supply [Min] | Voltage - Supply [Max] | Memory Organization | Memory Size |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics W66CM2NQUAGI TR | 200-WFBGA (10x14.5) | Surface Mount | Volatile | 200-WFBGA | DRAM | SDRAM - Mobile LPDDR4X | 1866 MHz | 18 ns | 95 °C | -40 °C | 1.06 V, 1.7 V | 1.17 V, 1.95 V | 256 M | 512 kb |
Winbond Electronics W66CM2NQUAGJ | 200-WFBGA (10x14.5) | Surface Mount | Volatile | 200-WFBGA | DRAM | SDRAM - Mobile LPDDR4X | 1866 MHz | 18 ns | 105 °C | -40 °C | 1.06 V, 1.7 V | 1.17 V, 1.95 V | 128 M | 512 kb |
Winbond Electronics W66CM2NQUAFJ TR | 200-WFBGA (10x14.5) | Surface Mount | Volatile | 200-WFBGA | DRAM | SDRAM - Mobile LPDDR4X | 1.6 GHz | 18 ns | 105 °C | -40 °C | 1.06 V, 1.7 V | 1.17 V, 1.95 V | 128 M | 512 kb |
Winbond Electronics W66CM2NQUAHJ TR | 200-WFBGA (10x14.5) | Surface Mount | Volatile | 200-WFBGA | DRAM | SDRAM - Mobile LPDDR4X | 2.133 GHz | 18 ns | 105 °C | -40 °C | 1.06 V, 1.7 V | 1.17 V, 1.95 V | 128 M | 512 kb |