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SAC57D53MCVLT

SAC57D53MCVLT

Obsolete

ARM 32-BIT MCU, TRIPLE CORE, 3MB FLASH, 1.3MB GRAM, 1MB SYSRAM, -40/+105DEGC, LQFP 208/ TRAY ROHS COMPLIANT: YES

SAC57D53MCVLT

SAC57D53MCVLT

Obsolete

ARM 32-BIT MCU, TRIPLE CORE, 3MB FLASH, 1.3MB GRAM, 1MB SYSRAM, -40/+105DEGC, LQFP 208/ TRAY ROHS COMPLIANT: YES

Description Specifications Series Pricing CAD Documents

Description

General part information

SAC57 Series

ARM® Cortex®-A5/M4/M0+ MAC57Dxxx Microcontroller IC 32-Bit Tri-Core 80MHz, 160MHz, 320MHz 3MB (3M x 8) FLASH 208-LQFP (28x28)

Technical Specifications

Parameters and characteristics for this part

Specification	SAC57D53MCVLT

A/D Channels	24 count
A/D Resolution (bits)	12 bit
Connectivity	LINbus, EMI, Ethernet, SPI, I2C, CANbus, EBI
Core Configuration	Tri-Core
Core Processor	ARM® Cortex®-A5/M4/M0+
Core Size (Bit Width)	32 Bit
Mounting Type	Surface Mount
Operating Temperature (Max)	105 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	Internal
Package / Case	208-LQFP Exposed Pad
Package Length	28 mm
Package Name	208-LQFP
Package Width	28 mm
Peripherals	DMA, HVD, POR, PWM, LVD, WDT, LCD
Program Memory Depth	3 M
Program Memory Size	3 MB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	2.3 M
RAM Size Width	8 bit
Speed	320 MHz, 160 MHz, 80 MHz
Voltage - Supply (Vcc/Vdd) Maximum	5.5 V
Voltage - Supply (Vcc/Vdd) Minimum	3.15 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

SAC57D53MCVLT | Datasheet

Product Change Notice EN

SAC57 Series

Part	Speed	Voltage - Supply (Vcc/Vdd) Maximum	Voltage - Supply (Vcc/Vdd) Minimum	Peripherals	Core Size (Bit Width)	Core Configuration	Program Memory Type	Package / Case	Operating Temperature (Max)	Operating Temperature (Min)	Program Memory Width	Program Memory Depth	Program Memory Size	RAM Size Depth	RAM Size Width	Core Processor	Oscillator Type	Package Length	Package Name	Package Width	A/D Resolution (bits)	A/D Channels	Connectivity	Mounting Type
NXP USA Inc. SAC57D53MCVLTR	80 MHz 160 MHz 320 MHz	5.5 V	3.15 V	DMA HVD LCD LVD POR PWM WDT	32 Bit	Tri-Core	FLASH	208-LQFP Exposed Pad	105 °C	-40 °C	8 bit	3 M	3 MB	2.3 M	8 bit	ARM® Cortex®-A5/M4/M0+	Internal	28 mm	208-LQFP	28 mm	12 bit	24 count	CANbus EBI EMI Ethernet I2C LINbus SPI	Surface Mount
NXP USA Inc. SAC57D52LCVLTR	80 MHz 160 MHz 320 MHz	5.5 V	3.15 V	DMA HVD LCD LVD POR PWM WDT	32 Bit	Tri-Core	FLASH	208-LQFP Exposed Pad	105 °C	-40 °C	8 bit	2 M	2 MB	2.3 M	8 bit	ARM® Cortex®-A5/M4/M0+	Internal	28 mm	208-LQFP	28 mm	12 bit	24 count	CANbus EBI EMI Ethernet I2C LINbus SPI	Surface Mount
NXP USA Inc. SAC57D54HCVLT	80 MHz 160 MHz 320 MHz	5.5 V	3.15 V	DMA HVD LCD LVD POR PWM WDT	32 Bit	Tri-Core	FLASH	208-LQFP Exposed Pad	105 °C	-40 °C	8 bit	4 M	4 MB	2.3 M	8 bit	ARM® Cortex®-A5/M4/M0+	Internal	28 mm	208-LQFP	28 mm	12 bit	24 count	CANbus EBI EMI Ethernet I2C LINbus SPI	Surface Mount
NXP USA Inc. SAC57D53MCVMOR	80 MHz 160 MHz 320 MHz	5.5 V	3.15 V	DMA HVD LCD LVD POR PWM WDT	32 Bit	Tri-Core	FLASH	516-BGA	105 °C	-40 °C	8 bit	3 M	3 MB	2.3 M	8 bit	ARM® Cortex®-A5/M4/M0+	Internal	27 mm	516-MAPBGA	27 mm	12 bit	24 count	CANbus EBI EMI Ethernet I2C LINbus SPI	Surface Mount
NXP USA Inc. SAC57D54HCVLTR	80 MHz 160 MHz 320 MHz	5.5 V	3.15 V	DMA HVD LCD LVD POR PWM WDT	32 Bit	Tri-Core	FLASH	208-LQFP Exposed Pad	105 °C	-40 °C	8 bit	4 M	4 MB	2.3 M	8 bit	ARM® Cortex®-A5/M4/M0+	Internal	28 mm	208-LQFP	28 mm	12 bit	24 count	CANbus EBI EMI Ethernet I2C LINbus SPI	Surface Mount
NXP USA Inc. SAC57D53MCVMO	80 MHz 160 MHz 320 MHz	5.5 V	3.15 V	DMA HVD LCD LVD POR PWM WDT	32 Bit	Tri-Core	FLASH	516-BGA	105 °C	-40 °C	8 bit	3 M	3 MB	2.3 M	8 bit	ARM® Cortex®-A5/M4/M0+	Internal	27 mm	516-MAPBGA	27 mm	12 bit	24 count	CANbus EBI EMI Ethernet I2C LINbus SPI	Surface Mount
NXP USA Inc. SAC57D52LCVLT	80 MHz 160 MHz 320 MHz	5.5 V	3.15 V	DMA HVD LCD LVD POR PWM WDT	32 Bit	Tri-Core	FLASH	208-LQFP Exposed Pad	105 °C	-40 °C	8 bit	2 M	2 MB	2.3 M	8 bit	ARM® Cortex®-A5/M4/M0+	Internal	28 mm	208-LQFP	28 mm	12 bit	24 count	CANbus EBI EMI Ethernet I2C LINbus SPI	Surface Mount
NXP USA Inc. SAC57D54HCVMOR	80 MHz 160 MHz 320 MHz	5.5 V	3.15 V	DMA HVD LCD LVD POR PWM WDT	32 Bit	Tri-Core	FLASH	516-BGA	105 °C	-40 °C	8 bit	4 M	4 MB	2.3 M	8 bit	ARM® Cortex®-A5/M4/M0+	Internal	27 mm	516-MAPBGA	27 mm	12 bit	24 count	CANbus EBI EMI Ethernet I2C LINbus SPI	Surface Mount
NXP USA Inc. SAC57D53MCVLT	80 MHz 160 MHz 320 MHz	5.5 V	3.15 V	DMA HVD LCD LVD POR PWM WDT	32 Bit	Tri-Core	FLASH	208-LQFP Exposed Pad	105 °C	-40 °C	8 bit	3 M	3 MB	2.3 M	8 bit	ARM® Cortex®-A5/M4/M0+	Internal	28 mm	208-LQFP	28 mm	12 bit	24 count	CANbus EBI EMI Ethernet I2C LINbus SPI	Surface Mount
NXP USA Inc. SAC57D54HCVMO	80 MHz 160 MHz 320 MHz	5.5 V	3.15 V	DMA HVD LCD LVD POR PWM WDT	32 Bit	Tri-Core	FLASH	516-BGA	105 °C	-40 °C	8 bit	4 M	4 MB	2.3 M	8 bit	ARM® Cortex®-A5/M4/M0+	Internal	27 mm	516-MAPBGA	27 mm	12 bit	24 count	CANbus EBI EMI Ethernet I2C LINbus SPI	Surface Mount