SAC57 Series

Catalog

ARM 32-BIT MCU, TRIPLE CORE, 3MB FLASH, 1.3MB GRAM, 1MB SYSRAM, -40/+105DEGC, LQFP 208/ REEL ROHS COMPLIANT: YES

Part	Speed	Voltage - Supply (Vcc/Vdd) Maximum	Voltage - Supply (Vcc/Vdd) Minimum	Peripherals	Core Size (Bit Width)	Core Configuration	Program Memory Type	Package / Case	Operating Temperature (Max)	Operating Temperature (Min)	Program Memory Width	Program Memory Depth	Program Memory Size	RAM Size Depth	RAM Size Width	Core Processor	Oscillator Type	Package Length	Package Name	Package Width	A/D Resolution (bits)	A/D Channels	Connectivity	Mounting Type
NXP USA Inc. SAC57D53MCVLTR	80 MHz 160 MHz 320 MHz	5.5 V	3.15 V	DMA HVD LCD LVD POR PWM WDT	32 Bit	Tri-Core	FLASH	208-LQFP Exposed Pad	105 °C	-40 °C	8 bit	3 M	3 MB	2.3 M	8 bit	ARM® Cortex®-A5/M4/M0+	Internal	28 mm	208-LQFP	28 mm	12 bit	24 count	CANbus EBI EMI Ethernet I2C LINbus SPI	Surface Mount
NXP USA Inc. SAC57D52LCVLTR	80 MHz 160 MHz 320 MHz	5.5 V	3.15 V	DMA HVD LCD LVD POR PWM WDT	32 Bit	Tri-Core	FLASH	208-LQFP Exposed Pad	105 °C	-40 °C	8 bit	2 M	2 MB	2.3 M	8 bit	ARM® Cortex®-A5/M4/M0+	Internal	28 mm	208-LQFP	28 mm	12 bit	24 count	CANbus EBI EMI Ethernet I2C LINbus SPI	Surface Mount
NXP USA Inc. SAC57D54HCVLT	80 MHz 160 MHz 320 MHz	5.5 V	3.15 V	DMA HVD LCD LVD POR PWM WDT	32 Bit	Tri-Core	FLASH	208-LQFP Exposed Pad	105 °C	-40 °C	8 bit	4 M	4 MB	2.3 M	8 bit	ARM® Cortex®-A5/M4/M0+	Internal	28 mm	208-LQFP	28 mm	12 bit	24 count	CANbus EBI EMI Ethernet I2C LINbus SPI	Surface Mount
NXP USA Inc. SAC57D53MCVMOR	80 MHz 160 MHz 320 MHz	5.5 V	3.15 V	DMA HVD LCD LVD POR PWM WDT	32 Bit	Tri-Core	FLASH	516-BGA	105 °C	-40 °C	8 bit	3 M	3 MB	2.3 M	8 bit	ARM® Cortex®-A5/M4/M0+	Internal	27 mm	516-MAPBGA	27 mm	12 bit	24 count	CANbus EBI EMI Ethernet I2C LINbus SPI	Surface Mount
NXP USA Inc. SAC57D54HCVLTR	80 MHz 160 MHz 320 MHz	5.5 V	3.15 V	DMA HVD LCD LVD POR PWM WDT	32 Bit	Tri-Core	FLASH	208-LQFP Exposed Pad	105 °C	-40 °C	8 bit	4 M	4 MB	2.3 M	8 bit	ARM® Cortex®-A5/M4/M0+	Internal	28 mm	208-LQFP	28 mm	12 bit	24 count	CANbus EBI EMI Ethernet I2C LINbus SPI	Surface Mount
NXP USA Inc. SAC57D53MCVMO	80 MHz 160 MHz 320 MHz	5.5 V	3.15 V	DMA HVD LCD LVD POR PWM WDT	32 Bit	Tri-Core	FLASH	516-BGA	105 °C	-40 °C	8 bit	3 M	3 MB	2.3 M	8 bit	ARM® Cortex®-A5/M4/M0+	Internal	27 mm	516-MAPBGA	27 mm	12 bit	24 count	CANbus EBI EMI Ethernet I2C LINbus SPI	Surface Mount
NXP USA Inc. SAC57D52LCVLT	80 MHz 160 MHz 320 MHz	5.5 V	3.15 V	DMA HVD LCD LVD POR PWM WDT	32 Bit	Tri-Core	FLASH	208-LQFP Exposed Pad	105 °C	-40 °C	8 bit	2 M	2 MB	2.3 M	8 bit	ARM® Cortex®-A5/M4/M0+	Internal	28 mm	208-LQFP	28 mm	12 bit	24 count	CANbus EBI EMI Ethernet I2C LINbus SPI	Surface Mount
NXP USA Inc. SAC57D54HCVMOR	80 MHz 160 MHz 320 MHz	5.5 V	3.15 V	DMA HVD LCD LVD POR PWM WDT	32 Bit	Tri-Core	FLASH	516-BGA	105 °C	-40 °C	8 bit	4 M	4 MB	2.3 M	8 bit	ARM® Cortex®-A5/M4/M0+	Internal	27 mm	516-MAPBGA	27 mm	12 bit	24 count	CANbus EBI EMI Ethernet I2C LINbus SPI	Surface Mount
NXP USA Inc. SAC57D53MCVLT	80 MHz 160 MHz 320 MHz	5.5 V	3.15 V	DMA HVD LCD LVD POR PWM WDT	32 Bit	Tri-Core	FLASH	208-LQFP Exposed Pad	105 °C	-40 °C	8 bit	3 M	3 MB	2.3 M	8 bit	ARM® Cortex®-A5/M4/M0+	Internal	28 mm	208-LQFP	28 mm	12 bit	24 count	CANbus EBI EMI Ethernet I2C LINbus SPI	Surface Mount
NXP USA Inc. SAC57D54HCVMO	80 MHz 160 MHz 320 MHz	5.5 V	3.15 V	DMA HVD LCD LVD POR PWM WDT	32 Bit	Tri-Core	FLASH	516-BGA	105 °C	-40 °C	8 bit	4 M	4 MB	2.3 M	8 bit	ARM® Cortex®-A5/M4/M0+	Internal	27 mm	516-MAPBGA	27 mm	12 bit	24 count	CANbus EBI EMI Ethernet I2C LINbus SPI	Surface Mount