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WAVE-29-127

WAVE-29-127

Active
Wakefield Thermal Solutions

LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES

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WAVE-29-127

WAVE-29-127

Active
Wakefield Thermal Solutions

LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES

Find alt

Description

General part information

WAVE-29 Series

Heat Sink BGA Aluminum Alloy Board Level

Technical Specifications

Parameters and characteristics for this part

SpecificationWAVE-29-127
Attachment MethodClip
Fin Height0.5 in
Length1.142 in
MaterialAluminum Alloy
Material FinishBlack Anodized
Package CooledBGA
ShapeSquare, Angled Fins
Thermal Resistance4.08 °C/W
TypeBoard Level
Width1.142 in

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

WAVE-29-127 | Datasheet