WAVE-29 Series
Manufacturer: Wakefield Thermal Solutions
Beta
⌘K
LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES
| Part | Attachment Method | Fin Height | Package Cooled | Width | Material Finish | Thermal Resistance | Shape | Length | Material | Type |
|---|---|---|---|---|---|---|---|---|---|---|
 Wakefield Thermal Solutions | Clip | 0.5 in | BGA | 1.142 in | Black Anodized | 4.08 °C/W | Angled Fins Square | 1.142 in | Aluminum Alloy | Board Level |
Wakefield Thermal Solutions | Clip | 0.5 in | BGA | 1.142 in | Black Anodized | 4.08 °C/W | Angled Fins Square | 1.142 in | Aluminum Alloy | Board Level |