
PMPB33XP,115
ActiveNexperia USA Inc.
TRANS MOSFET P-CH 20V 5.5A 6-PIN DFN-MD EP T/R

PMPB33XP,115
ActiveNexperia USA Inc.
TRANS MOSFET P-CH 20V 5.5A 6-PIN DFN-MD EP T/R
Description
General part information
PMPB33XP Series
P-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
Technical Specifications
Parameters and characteristics for this part
| Specification | PMPB33XP,115 |
|---|---|
| Current - Continuous Drain (Id) (Ta) | 5.5 A |
| Drain to Source Voltage (Vdss) | 20 V |
| Drive Voltage (Max Rds On) | 1.8 V |
| Drive Voltage (Min Rds On) | 4.5 V |
| FET Type | P-Channel |
| Gate Charge (Max) | 23 nC |
| Input Capacitance (Ciss) (Max) | 1575 pF |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 150 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | 6-UDFN Exposed Pad |
| Package Name | DFN2020MD-6 |
| Power Dissipation (Max) | 12.5 W, 1.7 W |
| Rds On (Max) | 37 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 12 V |
| Vgs(th) (Max) | 900 mV |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
小巧轻便的汽车 二极管和晶体管
RC Thermal Models
Understanding power MOSFET data sheet parameters
Thermal performance of DFN packages
DFN2020MD-6; Reel pack for SMD, 7''; Q2/T3 product orientation
Reflow soldering profile
Nexperia package poster
DFN2020MD-6; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending ,184 or Z Ordering code (12NC) ending 184
Using power MOSFETs in parallel
Failure signature of Electrical Overstress on Power MOSFETs
Small & light automotive diodes and transistors
plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body
MOSFET load switch PCB with thermal measurement
plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body
Automatic Optical Inspection of DFN Components
LFPAK MOSFET thermal design guide, Chinese version
Understanding power MOSFET data sheet parameters
Power MOSFET frequently asked questions and answers
Questions about package outline drawings
LFPAK MOSFET thermal design guide - Part 2
Power MOSFET single-shot and repetitive avalanche ruggedness rating