
BUK6Q66-60PJ
ActiveNexperia USA Inc.
BUK6Q66-60P/SOT8002/MLPAK33

BUK6Q66-60PJ
ActiveNexperia USA Inc.
BUK6Q66-60P/SOT8002/MLPAK33
Description
General part information
BUK6Q66-60P Series
P-channel enhancement mode Field-Effect Transistor (FET) in an MLPAK33 (SOT8002-3) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
Technical Specifications
Parameters and characteristics for this part
| Specification | BUK6Q66-60PJ |
|---|---|
| Current - Continuous Drain (Id) (Tc) | 20 A |
| Drain to Source Voltage (Vdss) | 60 V |
| Drive Voltage (Max Rds On) | 4.5 V |
| Drive Voltage (Min Rds On) | 10 V |
| FET Type | P-Channel |
| Gate Charge (Max) | 28 nC |
| Grade | Automotive |
| Input Capacitance (Ciss) (Max) | 1070 pF |
| Mounting Type | Wettable Flank, Surface Mount |
| Operating Temperature (Max) | 175 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | 8-PowerVDFN |
| Package Name | MLPAK33 |
| Power Dissipation (Max) | 56 W |
| Qualification | AEC-Q101 |
| Rds On (Max) | 66 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) | 2.7 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
MOSFET load switch PCB with thermal measurement
plastic thermal enhanced surface mounted package with side-wettable flanks (SWF); mini leads; 8 terminals;pitch 0.65 mm; 3.3 x 3.3 x 0.8 mm body
Leakage of small-signal MOSFETs
Using Power MOSFET Zth Curves
MOSFETs in Power Switch applications
Thermal boundary condition study on MOSFET packages and PCB substrates
Reverse battery protection in automotive applications
Understanding power MOSFET data sheet parameters