CONN RCPT 20POS 0.079 GOLD SMD
Part | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Type | Row Spacing - Mating | Row Spacing - Mating | Voltage Rating | Insulation Material | Mounting Type | Fastening Type | Number of Positions | Contact Finish - Post | Insulation Height | Insulation Height | Contact Shape | Termination | Connector Type | Style | Insulation Color | Number of Positions Loaded | Number of Rows | Features | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish - Mating | Pitch - Mating [x] | Pitch - Mating [x] | Contact Length - Post | Contact Length - Post |
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200 µin | 5.08 µm | Copper Alloy | UL94 V-0 | 30 Áin | 0.76 Ám | Female Socket | 0.079 in | 2 mm | 500 V | Thermoplastic | Surface Mount | Push-Pull | 20 | Tin-Lead | 4.65 mm | 0.183 in | Square | Solder | Receptacle | Board to Board, Cable | Black | All | 2 | Board Guide | 105 ░C | -55 °C | Gold | 0.079 in | 2 mm | |||
200 µin | 5.08 µm | Copper Alloy | UL94 V-0 | 30 Áin | 0.76 Ám | Female Socket | 0.079 in | 2 mm | 500 V | Thermoplastic | Through Hole | Push-Pull | 20 | Tin | 4.5 mm | 0.177 in | Square | Solder | Receptacle | Board to Board, Cable | Black | All | 2 | 105 ░C | -55 °C | Gold | 0.079 in | 2 mm | 2.54 mm | 0.1 in | ||
200 µin | 5.08 µm | Copper Alloy | UL94 V-0 | 30 Áin | 0.76 Ám | Female Socket | 0.079 in | 2 mm | 500 V | Thermoplastic | Surface Mount | Push-Pull | 20 | Tin | 4.65 mm | 0.183 in | Square | Solder | Receptacle | Board to Board, Cable | Black | All | 2 | Board Guide | 105 ░C | -55 °C | Gold | 0.079 in | 2 mm | |||
200 µin | 5.08 µm | Copper Alloy | UL94 V-0 | 30 Áin | 0.76 Ám | Female Socket | 0.079 in | 2 mm | 500 V | Thermoplastic | Through Hole | Push-Pull | 20 | Tin-Lead | 4.5 mm | 0.177 in | Square | Solder | Receptacle | Board to Board, Cable | Black | All | 2 | 105 ░C | -55 °C | Gold | 0.079 in | 2 mm | 2.54 mm | 0.1 in | ||
200 µin | 5.08 µm | Copper Alloy | UL94 V-0 | 15 µin | 0.38 µm | Female Socket | 0.079 in | 2 mm | 500 V | Thermoplastic | Surface Mount | Push-Pull | 20 | Tin-Lead | 4.65 mm | 0.183 in | Square | Solder | Receptacle | Board to Board, Cable | Black | All | 2 | 105 ░C | -55 °C | Gold | 0.079 in | 2 mm | ||||
200 µin | 5.08 µm | Copper Alloy | UL94 V-0 | 30 Áin | 0.76 Ám | Female Socket | 0.079 in | 2 mm | 500 V | Thermoplastic | Through Hole, Right Angle | Push-Pull | 20 | Tin-Lead | 4.55 mm | 0.179 " | Square | Solder | Receptacle | Board to Board, Cable | Black | All | 2 | 105 ░C | -55 °C | Gold | 0.079 in | 2 mm | 2.54 mm | 0.1 in | ||
200 µin | 5.08 µm | Copper Alloy | UL94 V-0 | 30 Áin | 0.76 Ám | Female Socket | 0.079 in | 2 mm | 500 V | Thermoplastic | Surface Mount | Push-Pull | 20 | Tin-Lead | 4.65 mm | 0.183 in | Square | Solder | Receptacle | Board to Board, Cable | Black | All | 2 | 105 ░C | -55 °C | Gold | 0.079 in | 2 mm |