CONN IC DIP SOCKET 64POS GOLD
| Part | Housing Material | Contact Finish - Post | Termination Post Length | Termination Post Length | Contact Material - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Mounting Type | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination | Pitch - Post | Pitch - Post | Contact Material - Mating | Features | Pitch - Mating | Pitch - Mating | Material Flammability Rating | Type | Type | Type | Current Rating (Amps) | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Mill-Max Manufacturing Corp. | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | Tin | 3.18 mm | 0.125 in | Brass Alloy | 30 Áin | 0.76 Ám | 64 | Through Hole | Gold | 200 µin | 5.08 µm | Solder | 0.07 in | 1.78 mm | Beryllium Copper | Open Frame | 0.07 in | 1.78 mm | UL94 V-0 | DIP | 0.6 in | 15.24 mm | 3 A | -55 °C | 125 °C | ||
Mill-Max Manufacturing Corp. | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | Tin | 3.18 mm | 0.125 in | Brass Alloy | 30 Áin | 0.76 Ám | 40 | Through Hole | Gold | 200 µin | 5.08 µm | Solder | 0.07 in | 1.78 mm | Beryllium Copper | Open Frame | 0.07 in | 1.78 mm | UL94 V-0 | DIP | 0.6 in | 15.24 mm | 3 A | -55 °C | 125 °C | 20 | 2 |
Mill-Max Manufacturing Corp. | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | Tin | 3.18 mm | 0.125 in | Brass Alloy | 30 Áin | 0.76 Ám | 48 | Through Hole | Gold | 200 µin | 5.08 µm | Solder | 0.07 in | 1.78 mm | Beryllium Copper | Open Frame | 0.07 in | 1.78 mm | UL94 V-0 | DIP | 0.6 in | 15.24 mm | 3 A | -55 °C | 125 °C | ||
Mill-Max Manufacturing Corp. | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | Tin | 3.18 mm | 0.125 in | Brass Alloy | 30 Áin | 0.76 Ám | 28 | Through Hole | Gold | 200 µin | 5.08 µm | Solder | 0.07 in | 1.78 mm | Beryllium Copper | Open Frame | 0.07 in | 1.78 mm | UL94 V-0 | DIP | 0.4 in | 10.16 mm | 3 A | -55 °C | 125 °C | ||
Mill-Max Manufacturing Corp. | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | Tin | 3.18 mm | 0.125 in | Brass Alloy | 30 Áin | 0.76 Ám | 28 | Through Hole | Gold | 200 µin | 5.08 µm | Solder | 0.07 in | 1.78 mm | Beryllium Copper | Open Frame | 0.07 in | 1.78 mm | UL94 V-0 | DIP | 0.4 in | 10.16 mm | 3 A | -55 °C | 125 °C | ||
Mill-Max Manufacturing Corp. | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | Tin | 3.18 mm | 0.125 in | Brass Alloy | 30 Áin | 0.76 Ám | 56 | Through Hole | Gold | 200 µin | 5.08 µm | Solder | 0.07 in | 1.78 mm | Beryllium Copper | Open Frame | 0.07 in | 1.78 mm | UL94 V-0 | DIP | 0.6 in | 15.24 mm | 3 A | -55 °C | 125 °C | ||
Mill-Max Manufacturing Corp. | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | Tin | 3.18 mm | 0.125 in | Brass Alloy | 30 Áin | 0.76 Ám | 64 | Through Hole | Gold | 200 µin | 5.08 µm | Solder | 0.07 in | 1.78 mm | Beryllium Copper | Open Frame | 0.07 in | 1.78 mm | UL94 V-0 | DIP | 0.75 in | 19.05 mm | 3 A | -55 °C | 125 °C | ||
Mill-Max Manufacturing Corp. | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | Tin | 3.18 mm | 0.125 in | Brass Alloy | 30 Áin | 0.76 Ám | 40 | Through Hole | Gold | 200 µin | 5.08 µm | Solder | 0.07 in | 1.78 mm | Beryllium Copper | Open Frame | 0.07 in | 1.78 mm | UL94 V-0 | DIP | 0.6 in | 15.24 mm | 3 A | -55 °C | 125 °C | 20 | 2 |
Mill-Max Manufacturing Corp. | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | Tin | 3.18 mm | 0.125 in | Brass Alloy | 30 Áin | 0.76 Ám | 20 | Through Hole | Gold | 200 µin | 5.08 µm | Solder | 0.07 in | 1.78 mm | Beryllium Copper | Open Frame | 0.07 in | 1.78 mm | UL94 V-0 | DIP | 0.6 in | 15.24 mm | 3 A | -55 °C | 125 °C | ||
Mill-Max Manufacturing Corp. | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | Tin | 3.18 mm | 0.125 in | Brass Alloy | 30 Áin | 0.76 Ám | 56 | Through Hole | Gold | 200 µin | 5.08 µm | Solder | 0.07 in | 1.78 mm | Beryllium Copper | Open Frame | 0.07 in | 1.78 mm | UL94 V-0 | DIP | 0.6 in | 15.24 mm | 3 A | -55 °C | 125 °C |