HPF-06 Series

Catalog

.200 HI POWER SOCKET ASSEMBLY

Part	Contact Material	Insulation Material	Contact Shape	Insulation Height	Number of Positions	Contact Type	Contact Finish - Post	Style	Features	Fastening Type	Pitch - Mating	Connector Type	Contact Finish - Mating	Insulation Color	Number of Rows	Mounting Type	Termination	Number of Positions Loaded	Contact Length - Post
Samtec Inc. HPF-06-02-T-S-LC-K	Beryllium Copper	Liquid Crystal Polymer (LCP)	Square	0.351 in	6	Female Socket	Tin	Board	Board Lock Pick and Place	Push-Pull	0.2 in	Receptacle	Tin	Black	1	Surface Mount	Solder	All
Samtec Inc. HPF-06-02-TM-S-TR	Beryllium Copper	Liquid Crystal Polymer (LCP)	Square	0.351 in	6	Female Socket	Tin	Board		Push-Pull	0.2 in	Receptacle	Tin	Black	1	Surface Mount	Solder	All
Samtec Inc. HPF-06-02-T-S-TR	Beryllium Copper	Liquid Crystal Polymer (LCP)	Square	0.351 in	6	Female Socket	Tin	Board		Push-Pull	0.2 in	Receptacle	Tin	Black	1	Surface Mount	Solder	All
Samtec Inc. HPF-06-01-TM-S	Beryllium Copper	Liquid Crystal Polymer (LCP)	Square	0.351 in	6	Female Socket	Tin	Board		Push-Pull	0.2 in	Receptacle	Tin	Black	1	Through Hole	Solder	All	0.102 in
Samtec Inc. HPF-06-02-T-S-K-TR	Beryllium Copper	Liquid Crystal Polymer (LCP)	Square	0.351 in	6	Female Socket	Tin	Board	Pick and Place	Push-Pull	0.2 in	Receptacle	Tin	Black	1	Surface Mount	Solder	All
Samtec Inc. HPF-06-01-T-S	Beryllium Copper	Liquid Crystal Polymer (LCP)	Square	0.351 in	6	Female Socket	Tin	Board		Push-Pull	0.2 in	Receptacle	Tin	Black	1	Through Hole	Solder	All	0.102 in