CONN RCPT 100POS 0.05 GOLD SMD
| Part | Row Spacing - Mating | Row Spacing - Mating | Fastening Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Current Rating (Amps) | Contact Material | Termination | Pitch - Mating | Pitch - Mating | Mounting Type | Contact Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Shape | Insulation Color | Contact Finish - Mating | Insulation Material | Insulation Height [z] | Insulation Height [z] | Number of Positions | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Post | Connector Type | Material Flammability Rating | Number of Positions Loaded | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.05 in | 1.27 mm | Push-Pull | 3 µin | 0.076 µm | 2.4 A | Phosphor Bronze | Solder | 0.05 in | 1.27 mm | Surface Mount | Forked | 30 Áin | 0.76 Ám | Square | Black | Gold | Liquid Crystal Polymer (LCP) | 0.16 in | 4.06 mm | 100 | -55 °C | 125 °C | Gold | Receptacle | UL94 V-0 | All | |
Samtec Inc. | 0.05 in | 1.27 mm | Push-Pull | 3 µin | 0.076 µm | 2.4 A | Phosphor Bronze | Solder | 0.05 in | 1.27 mm | Surface Mount | Forked | 3 µin | 0.076 µm | Square | Black | Gold | Liquid Crystal Polymer (LCP) | 0.16 in | 4.06 mm | 100 | -55 °C | 125 °C | Gold | Receptacle | UL94 V-0 | All | Board Lock Pick and Place |
Samtec Inc. | 0.05 in | 1.27 mm | Push-Pull | 3 µin | 0.076 µm | 2.4 A | Phosphor Bronze | Solder | 0.05 in | 1.27 mm | Surface Mount | Forked | 30 Áin | 0.76 Ám | Square | Black | Gold | Liquid Crystal Polymer (LCP) | 0.16 in | 4.06 mm | 100 | -55 °C | 125 °C | Gold | Receptacle | UL94 V-0 | All | Board Lock Pick and Place |
Samtec Inc. | 0.05 in | 1.27 mm | Push-Pull | 3 µin | 0.076 µm | 2.4 A | Phosphor Bronze | Solder | 0.05 in | 1.27 mm | Surface Mount | Forked | 30 Áin | 0.76 Ám | Square | Black | Gold | Liquid Crystal Polymer (LCP) | 0.16 in | 4.06 mm | 100 | -55 °C | 125 °C | Gold | Receptacle | UL94 V-0 | All | Board Guide Pick and Place |
Samtec Inc. | 0.05 in | 1.27 mm | Push-Pull | 3 µin | 0.076 µm | 2.4 A | Phosphor Bronze | Solder | 0.05 in | 1.27 mm | Surface Mount | Forked | 3 µin | 0.076 µm | Square | Black | Gold | Liquid Crystal Polymer (LCP) | 0.16 in | 4.06 mm | 100 | -55 °C | 125 °C | Gold | Receptacle | UL94 V-0 | All | Pick and Place |
Samtec Inc. | 0.05 in | 1.27 mm | Push-Pull | 3 µin | 0.076 µm | 2.4 A | Phosphor Bronze | Solder | 0.05 in | 1.27 mm | Surface Mount | Forked | 30 Áin | 0.76 Ám | Square | Black | Gold | Liquid Crystal Polymer (LCP) | 0.16 in | 4.06 mm | 100 | -55 °C | 125 °C | Gold | Receptacle | UL94 V-0 | All | Pick and Place |
Samtec Inc. | 0.05 in | 1.27 mm | Push-Pull | 3 µin | 0.076 µm | 2.4 A | Phosphor Bronze | Solder | 0.05 in | 1.27 mm | Surface Mount | Forked | 10 çin | 0.25 çm | Square | Black | Gold | Liquid Crystal Polymer (LCP) | 0.16 in | 4.06 mm | 100 | -55 °C | 125 °C | Gold | Receptacle | UL94 V-0 | All | Board Guide Pick and Place |
Samtec Inc. | 0.05 in | 1.27 mm | Push-Pull | 3 µin | 0.076 µm | 2.4 A | Phosphor Bronze | Solder | 0.05 in | 1.27 mm | Surface Mount | Forked | 3 µin | 0.076 µm | Square | Black | Gold | Liquid Crystal Polymer (LCP) | 0.16 in | 4.06 mm | 100 | -55 °C | 125 °C | Gold | Receptacle | UL94 V-0 | All | Pick and Place |
Samtec Inc. | 0.05 in | 1.27 mm | Push-Pull | 3 µin | 0.076 µm | 2.4 A | Phosphor Bronze | Solder | 0.05 in | 1.27 mm | Surface Mount | Forked | 10 çin | 0.25 çm | Square | Black | Gold | Liquid Crystal Polymer (LCP) | 0.16 in | 4.06 mm | 100 | -55 °C | 125 °C | Gold | Receptacle | UL94 V-0 | All | Board Guide Pick and Place |
Samtec Inc. | 0.05 in | 1.27 mm | Push-Pull | 3 µin | 0.076 µm | 2.4 A | Phosphor Bronze | Solder | 0.05 in | 1.27 mm | Surface Mount | Forked | 30 Áin | 0.76 Ám | Square | Black | Gold | Liquid Crystal Polymer (LCP) | 0.16 in | 4.06 mm | 100 | -55 °C | 125 °C | Gold | Receptacle | UL94 V-0 | All | Board Guide |