32-6554 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS TIN

Part	Type	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Termination	Housing Material	Mounting Type	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination Post Length	Termination Post Length	Contact Material - Mating	Current Rating (Amps)	Material Flammability Rating	Features	Contact Material - Post	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Mating
Aries Electronics 32-6554-10	15.24 mm	DIP ZIF (ZIP)	0.6 "	200 µin	5.08 µm	Tin	0.1 in	2.54 mm	2 x 16	32	Solder	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	2.54 mm	0.1 in	5.08 µm	200 µin	0.11 in	2.78 mm	Beryllium Copper	1 A	UL94 V-0	Closed Frame	Beryllium Copper
Aries Electronics 32-6554-18	15.24 mm	DIP ZIF (ZIP)	0.6 "	50 µin	1.27 µm	Nickel Boron	0.1 in	2.54 mm	2 x 16	32	Solder	Polyetheretherketone (PEEK) Glass Filled	Through Hole	2.54 mm	0.1 in	1.27 µm	50 µin	0.11 in	2.78 mm	Beryllium Nickel	1 A	UL94 V-0	Closed Frame	Beryllium Nickel	-55 °C	250 °C	Nickel Boron
Aries Electronics 32-6554-11	15.24 mm	DIP ZIF (ZIP)	0.6 "			Gold	0.1 in	2.54 mm	2 x 16	32	Solder	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	2.54 mm	0.1 in			0.11 in	2.78 mm	Beryllium Copper	1 A	UL94 V-0	Closed Frame	Beryllium Copper			Gold